參數(shù)資料
型號: LT6106CS5#TRMPBF
廠商: Linear Technology
文件頁數(shù): 3/12頁
文件大小: 0K
描述: IC AMP CURRENT SENSE TSOT23-5
標準包裝: 1
放大器類型: 電流檢測
電路數(shù): 1
-3db帶寬: 200kHz
電流 - 輸入偏壓: 40nA
電壓 - 輸入偏移: 150µV
電流 - 電源: 70µA
電流 - 輸出 / 通道: 1mA
電壓 - 電源,單路/雙路(±): 2.7 V ~ 36 V
工作溫度: 0°C ~ 70°C
安裝類型: 表面貼裝
封裝/外殼: SOT-23-5 細型,TSOT-23-5
供應(yīng)商設(shè)備封裝: TSOT-23-5
包裝: 標準包裝
產(chǎn)品目錄頁面: 1320 (CN2011-ZH PDF)
其它名稱: LT6106CS5#TRMPBFDKR
LT6106
11
6106fa
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
PACKAGE DESCRIPTION
APPLICATIONS INFORMATION
In addition, if the output of the LT6106 is wired to a de-
vice that will effectively short it to high voltage (such as
through an ESD protection clamp) during a reverse sup-
ply condition, the LT6106’s output should be connected
through a resistor or Schottky diode (Figure 7).
Demo Board
Demo board DC1240 is available for evaluation of the
LT6106.
Response Time
The photos in the Typical Performance Characteristics show
the response of the LT6106 to a variety of input conditions
and values of RIN. The photos show that if the output cur-
rent is very low or zero and an input transient occurs, there
will be an increased delay before the output voltage begins
changing while internal nodes are being charged.
Figure 6. Schottky Diode Prevents Damage During Supply Reversal
Figure 7. Additional Resistor R3 Protects Output
During Supply Reversal
S5 Package
5-Lead Plastic TSOT-23
(Reference LTC DWG # 05-08-1635)
1.50 – 1.75
(NOTE 4)
2.80 BSC
0.30 – 0.45 TYP
5 PLCS (NOTE 3)
DATUM ‘A’
0.09 – 0.20
(NOTE 3)
S5 TSOT-23 0302 REV B
PIN ONE
2.90 BSC
(NOTE 4)
0.95 BSC
1.90 BSC
0.80 – 0.90
1.00 MAX
0.01 – 0.10
0.20 BSC
0.30 – 0.50 REF
NOTE:
1. DIMENSIONS ARE IN MILLIMETERS
2. DRAWING NOT TO SCALE
3. DIMENSIONS ARE INCLUSIVE OF PLATING
4. DIMENSIONS ARE EXCLUSIVE OF MOLD FLASH AND METAL BURR
5. MOLD FLASH SHALL NOT EXCEED 0.254mm
6. JEDEC PACKAGE REFERENCE IS MO-193
3.85 MAX
0.62
MAX
0.95
REF
RECOMMENDED SOLDER PAD LAYOUT
PER IPC CALCULATOR
1.4 MIN
2.62 REF
1.22 REF
6106 F06
LT6106
R2
4.99k
D1
VBATT
RSENSE
L
O
A
D
V+
V
OUT
–IN
+IN
+
R1
100Ω
6106 F07
LT6106
R2
4.99k
D1
VBATT
R3
1k
RSENSE
L
O
A
D
V+
V
OUT
–IN
+IN
ADC
R1
100Ω
+
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