參數(shù)資料
型號(hào): LT6600IS8-10#TR
廠商: Linear Technology
文件頁(yè)數(shù): 4/16頁(yè)
文件大?。?/td> 0K
描述: IC AMP DIFF FILTER 2.5MHZ 8SOIC
標(biāo)準(zhǔn)包裝: 2,500
放大器類型: 差分
電路數(shù): 1
輸出類型: 差分
電流 - 輸入偏壓: 40µA
電壓 - 輸入偏移: 8000µV
電流 - 電源: 36mA
電壓 - 電源,單路/雙路(±): 3 V ~ 11 V,±1.5 V ~ 5.5 V
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 8-SOIC(0.154",3.90mm 寬)
供應(yīng)商設(shè)備封裝: 8-SO
包裝: 帶卷 (TR)
LT6600-10
12
66001fe
APPLICATIONS INFORMATION
Power Dissipation
The LT6600-10 ampliers combine high speed with large-
signal currents in a small package. There is a need to
ensure that the dies’s junction temperature does not exceed
150°C. The LT6600-10 S8 package has Pin 6 fused to the
lead frame to enhance thermal conduction when connect-
ing to a ground plane or a large metal trace. Metal trace
and plated through-holes can be used to spread the heat
generated by the device to the backside of the PC board.
For example, on a 3/32" FR-4 board with 2oz copper, a
total of 660 square millimeters connected to Pin 6 of the
LT6600-10 S8 (330 square millimeters on each side of the
PC board) will result in a thermal resistance,
θJA,of about
85°C/W. Without the extra metal trace connected to the
Vpin to provide a heat sink, the thermal resistance will
be around 105°C/W. Table 2 can be used as a guide when
considering thermal resistance.
Table 2. LT6600-10 SO-8 Package Thermal Resistance
COPPER AREA
TOPSIDE
(mm2)
BACKSIDE
(mm2)
BOARD AREA
(mm2)
THERMAL RESISTANCE
(JUNCTION-TO-AMBIENT)
1100
2500
65°C/W
330
2500
85°C/W
35
2500
95°C/W
35
0
2500
100°C/W
0
2500
105°C/W
Junction temperature, TJ, is calculated from the ambient
temperature, TA, and power dissipation, PD. The power
dissipation is the product of supply voltage, VS, and
supply current, IS. Therefore, the junction temperature
is given by:
TJ = TA + (PD θJA) = TA + (VS IS θJA)
where the supply current, IS,isafunctionofsignallevel,load
impedance, temperature and common mode voltages.
For a given supply voltage, the worst-case power dis-
sipation occurs when the differential input signal is
maximum, the common mode currents are maximum
(see the Applications Information section regarding com-
mon mode DC currents), the load impedance is small and
the ambient temperature is maximum. To compute the
junction temperature, measure the supply current under
these worst-case conditions, estimate the thermal resis-
tance from Table 2, then apply the equation for TJ. For
example, using the circuit in Figure 3 with DC differential
input voltage of 250mV, a differential output voltage of 1V,
no load resistance and an ambient temperature of 85°C,
the supply current (current into V+) measures 48.9mA.
Assuming a PC board layout with a 35mm2 copper trace,
the
θJA is 100°C/W. The resulting junction temperature is:
TJ = TA + (PD θJA) = 85 + (5 0.0489 100) = 109°C
When using higher supply voltages or when driving small
impedances, more copper may be necessary to keep TJ
below 150°C.
Figure 8
FREQUENCY (MHz)
0.1
SPECTRAL
DENSIT
Y
(nV
RMS
/√Hz)
INTEGRA
TED
NOISE
(mV
RMS
)
35
30
25
20
15
10
5
0
140
120
100
80
60
40
20
0
1.0
10
100
6600 F08
SPECTRAL DENSITY
INTEGRATED
NOISE
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