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參數資料
| 型號： | LTC1955EUH |
| 廠商： | LINEAR TECHNOLOGY CORP |
| 元件分類： | 電源管理 |
| 英文描述： | Dual Smart Card Interface with Serial Control |
| 中文描述： | 2-CHANNEL POWER SUPPLY SUPPORT CKT, PQCC32 |
| 封裝： | 5 X 5 MM, 0.75 MM HEIGHT, MO-220WHHD, QFN-32 |
| 文件頁數： | 14/20頁 |
| 文件大?。?/td> | 259K |
| 代理商： | LTC1955EUH |
LTC1955
14
sn1955 1955fs
10kV ESD Protection
All smart card pins (CLK A/CLK B, RST A/RST B, I/O A/
I/OB, C4A, C8A and V
CCA
/V
CCB
) can withstand over 10kV
of human body model ESD in-situ. In order to ensure
proper ESD protection, careful board layout is required.
The PGND and SGND pins should be tied directly to a
ground plane. The V
CCA
/V
CCB
capacitors should be located
very close to the V
CCA
/V
CCB
pins and tied immediately to
the ground plane.
Capacitor Selection
Warning: A polarized capacitor such as tantalum or alumi-
num should never be used for the flying capacitor since ts
voltage can reverse upon start up of the LTC1955. Low
ESR ceramic capacitors should always be used for the
flying capacitor.
A total of six capacitors are required to operate the
LTC1955. An input bypass capacitor is required at PV
BATT
,
SV
BATT
and DV
CC
. Output bypass capacitors are required
on each of the smart card V
CCA
/V
CCB
pins. A charge pump
flying capacitor is required from C
+
to C
–
and a charge
storage capacitor is required on the charge pump out pin
CPO.
To prevent excessive noise spikes due to charge pump
operation, low ESR (equivalent series resistance) multi-
layer ceramic capacitors are strongly recommended.
There are several types of ceramic capacitors available
each having considerably different characteristics. For
example, X7R/X5R ceramic capacitors have excellent volt-
age and temperature stability but relatively low packing
density. Y5V ceramic capacitors have apparently higher
packing density but poor performance over their rated
voltage or temperature ranges. Under certain voltage and
temperature conditions, Y5V and X7R/X5R ceramic ca-
pacitors can be compared directly by case size rather than
specified value for a desired minimum capacitance.
Placement of the capacitors is critical for correct operation
of the LTC1955. Because the charge pump generates large
current steps, all of the capacitors should be placed as
close to the LTC1955 as possible. The low impedance
nature of multilayer ceramic chip capacitors will minimize
voltage spikes but only if the power path is kept very short
APPLICATIU
W
U
U
(i.e., minimum inductance). The PV
BATT
/SV
BATT
nodes
should be especially well bypassed. The capacitor for this
node should be directly adjacent to the QFN package. The
C
PO
and flying capacitors should be very close as well. The
LTC1955 can tolerate more distance between the LDO
capacitors and the V
CCA/B
pins.
Figure 4 shows an example of a tight printed circuit board
using single layer copper. For best performance a multi-
layer board can be used and should employ a solid ground
plane on at least one layer.
The following capacitors are recommended for use with
the LTC1955:
Type
X5R
Value
4.7
μ
F
Case Size
0805
Murata P/N
GRM40-034 X5R 475K 6.3
C
IN
CPO
C
FLY
V
CCA/B
CDV
CC
X5R
1
μ
F
0603
GRM39 X5R 105K 6.3
X5R
0.1
μ
F
0402
GRM36 X5R 104K 10
V
CCA
GND
V
BATT
V
CCB
1955 F04
Figure 4. Optimum Single Layer PCB Layout
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相關代理商/技術參數 |
參數描述 |
|---|---|
| LTC1955EUH#PBF | 功能描述:IC INTERFACE DL SMART CARD 32QFN RoHS:是 類別:集成電路 (IC) >> 接口 - 控制器 系列:- 標準包裝:2,450 系列:- 控制器類型:SPI 總線至 I²C 總線橋接 接口:I²C，串行，SPI 電源電壓:2.4 V ~ 3.6 V 電流 - 電源:11mA 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:24-VFQFN 裸露焊盤 供應商設備封裝:24-HVQFN（4x4） 包裝:托盤 配用:568-3511-ND - DEMO BOARD SPI TO I2C 其它名稱:935286452157SC18IS600IBSSC18IS600IBS-ND |
| LTC1955EUH#TR | 功能描述:IC SMART CARD INTERFC DUAL 32QFN RoHS:否 類別:集成電路 (IC) >> 接口 - 控制器 系列:- 標準包裝:2,450 系列:- 控制器類型:SPI 總線至 I²C 總線橋接 接口:I²C，串行，SPI 電源電壓:2.4 V ~ 3.6 V 電流 - 電源:11mA 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:24-VFQFN 裸露焊盤 供應商設備封裝:24-HVQFN（4x4） 包裝:托盤 配用:568-3511-ND - DEMO BOARD SPI TO I2C 其它名稱:935286452157SC18IS600IBSSC18IS600IBS-ND |
| LTC1955EUH#TRPBF | 功能描述:IC INTERFACE DL SMART CARD 32QFN RoHS:是 類別:集成電路 (IC) >> 接口 - 控制器 系列:- 標準包裝:2,450 系列:- 控制器類型:SPI 總線至 I²C 總線橋接 接口:I²C，串行，SPI 電源電壓:2.4 V ~ 3.6 V 電流 - 電源:11mA 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:24-VFQFN 裸露焊盤 供應商設備封裝:24-HVQFN（4x4） 包裝:托盤 配用:568-3511-ND - DEMO BOARD SPI TO I2C 其它名稱:935286452157SC18IS600IBSSC18IS600IBS-ND |
| LTC1955IUH#PBF | 功能描述:IC SMART CARD INTERFACE DL 32QFN RoHS:是 類別:集成電路 (IC) >> 接口 - 控制器 系列:- 標準包裝:2,450 系列:- 控制器類型:SPI 總線至 I²C 總線橋接 接口:I²C，串行，SPI 電源電壓:2.4 V ~ 3.6 V 電流 - 電源:11mA 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:24-VFQFN 裸露焊盤 供應商設備封裝:24-HVQFN（4x4） 包裝:托盤 配用:568-3511-ND - DEMO BOARD SPI TO I2C 其它名稱:935286452157SC18IS600IBSSC18IS600IBS-ND |
| LTC1955IUH#TRPBF | 功能描述:IC SMART CARD INTERFACE DL 32QFN RoHS:是 類別:集成電路 (IC) >> 接口 - 控制器 系列:- 標準包裝:2,450 系列:- 控制器類型:SPI 總線至 I²C 總線橋接 接口:I²C，串行，SPI 電源電壓:2.4 V ~ 3.6 V 電流 - 電源:11mA 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:24-VFQFN 裸露焊盤 供應商設備封裝:24-HVQFN（4x4） 包裝:托盤 配用:568-3511-ND - DEMO BOARD SPI TO I2C 其它名稱:935286452157SC18IS600IBSSC18IS600IBS-ND |
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