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參數(shù)資料
| 型號： | LTC2162CUK#TRPBF |
| 廠商： | LINEAR TECHNOLOGY CORP |
| 元件分類： | ADC |
| 英文描述： | 1-CH 16-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, PQCC48 |
| 封裝： | 7 X 7 MM, LEAD FREE, PLASTIC, MO-220WKKD-2, QFN-48 |
| 文件頁數(shù)： | 24/36頁 |
| 文件大?。?/td> | 651K |
| 代理商： | LTC2162CUK#TRPBF |
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LTC2162/LTC2161/LTC2160
30
216210f
GROUNDING AND BYPASSING
The LTC2162/LTC2161/LTC2160 requires a printed circuit
board with a clean unbroken ground plane in the first
layer beneath the ADC. A multilayer board with an internal
ground plane is recommended. Layout for the printed
circuit board should ensure that digital and analog signal
lines are separated as much as possible. In particular, care
should be taken not to run any digital track alongside an
analog signal track or underneath the ADC.
High quality ceramic bypass capacitors should be used at
the VDD, OVDD, VCM, VREF, REFH and REFL pins. Bypass
capacitors must be located as close to the pins as pos-
sible.Size0402ceramiccapacitorsarerecommended.The
traces connecting the pins and bypass capacitors must
be kept short and should be made as wide as possible.
applicaTions inForMaTion
Of particular importance is the capacitor between REFH
and REFL. This capacitor should be on the same side of
the circuit board as the A/D, and as close to the device
as possible.
The analog inputs, encode signals, and digital outputs
should not be routed next to each other. Ground fill and
grounded vias should be used as barriers to isolate these
signals from each other.
HEAT TRANSFER
Most of the heat generated by the LTC2162/LTC2161/
LTC2160 is transferred from the die through the bottom-
sideexposedpadandpackageleadsontotheprintedcircuit
board. For good electrical and thermal performance, the
exposed pad must be soldered to a large grounded pad
on the PC board. This pad should be connected to the
internal ground planes by an array of vias.
相關PDF資料 |
PDF描述 |
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| LTC2162IUK#PBF | 1-CH 16-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, PQCC48 |
| LTC2162IUK#TRPBF | 1-CH 16-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, PQCC48 |
| LTC2161CUK#TRPBF | 1-CH 16-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, PQCC48 |
| LTC2160CUK#PBF | 1-CH 16-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, PQCC48 |
| LTC2162CUK#PBF | 1-CH 16-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, PQCC48 |
相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| LTC2162IUK#PBF | 制造商:Linear Technology 功能描述:ADC Single 65Msps 16-bit Parallel/Serial (SPI)/LVDS 48-Pin QFN EP 制造商:Linear Technology 功能描述:Single ADC 65Msps 16-bit Parallel/Serial (SPI)/LVDS 48-Pin QFN EP 制造商:Linear Technology 功能描述:IC ADC 16BIT 65 MSPS 48-QFN 制造商:Linear Technology 功能描述:MS-ADC/High Speed, 16-bit, 65Msps, 1.8V Low-Power ADC, Parallel Outputs |
| LTC2162IUK#TRPBF | 制造商:Linear Technology 功能描述:ADC Single 65Msps 16-bit Parallel/Serial (SPI)/LVDS 48-Pin QFN EP T/R 制造商:Linear Technology 功能描述:IC ADC 16BIT 65 MSPS 48-QFN |
| LTC2163CUK#PBF | 制造商:Linear Technology 功能描述:ADC Single 80Msps 16-bit Parallel/Serial (SPI)/LVDS 48-Pin QFN EP 制造商:Linear Technology 功能描述:IC ADC 16BIT PAR/SRL 80MSP 48QFN 制造商:Linear Technology 功能描述:ADC 16BIT 80MSPS 48QFN 制造商:Linear Technology 功能描述:ADC, 16BIT, 80MSPS, 48QFN |
| LTC2163CUK#TRPBF | 制造商:Linear Technology 功能描述:ADC Single 80Msps 16-bit Parallel/Serial (SPI)/LVDS 48-Pin QFN EP T/R 制造商:Linear Technology 功能描述:IC ADC 16BIT PAR/SRL 80MSP 48QFN |
| LTC2163IUK#PBF | 制造商:Linear Technology 功能描述:IC ADC 16BIT PAR/SRL 80MSP 48QFN |
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