參數(shù)資料
型號: LTC2230CUP#TRPBF
廠商: Linear Technology
文件頁數(shù): 5/32頁
文件大小: 0K
描述: IC ADC 10BIT 170MSPS 64-QFN
標(biāo)準(zhǔn)包裝: 2,000
位數(shù): 10
采樣率(每秒): 170M
數(shù)據(jù)接口: 并聯(lián)
轉(zhuǎn)換器數(shù)目: 1
功率耗散(最大): 1.18W
電壓電源: 單電源
工作溫度: 0°C ~ 70°C
安裝類型: 表面貼裝
封裝/外殼: 64-WFQFN 裸露焊盤
供應(yīng)商設(shè)備封裝: 64-QFN(9x9)
包裝: 帶卷 (TR)
輸入數(shù)目和類型: 1 個單端,雙極; 1 個差分,雙極
LTC2230/LTC2231
13
22301fb
MODE (Pin 58): Output Format and Clock Duty Cycle
Stabilizer Selection Pin. Connecting MODE to 0V selects
offset binary output format and turns the clock duty cycle
stabilizer off. Connecting MODE to 1/3VDD selects offset
binary output format and turns the clock duty cycle stabi-
lizer on. Connecting MODE to 2/3VDD selects 2’s comple-
ment output format and turns the clock duty cycle stabi-
lizer on. Connecting MODE to VDD selects 2’s complement
output format and turns the clock duty cycle stabilizer off.
SENSE (Pin 59): Reference Programming Pin. Connecting
SENSE to VCM selects the internal reference and a ±0.5V
input range. VDD selects the internal reference and a ±1V
input range. An external reference greater than 0.5V and
less than 1V applied to SENSE selects an input range of
±VSENSE. ±1V is the largest valid input range.
VCM (Pin 60): 1.6V Output and Input Common Mode Bias.
Bypass to ground with 2.2
μF ceramic chip capacitor.
GND (Exposed Pad) (Pin 65): ADC Power Ground. The
exposed pad on the bottom of the package needs to be
soldered to ground.
(LVDS Mode)
AIN+ (Pins 1, 2): Positive Differential Analog Input.
AIN(Pins 3, 4): Negative Differential Analog Input.
REFHA (Pins 5, 6): ADC High Reference. Bypass to
Pins 7, 8 with 0.1
μF ceramic chip capacitor, to Pins 11, 12
with a 2.2
μF ceramic capacitor and to ground with 1μF
ceramic capacitor.
REFLB (Pins 7, 8): ADC Low Reference. Bypass to Pins 5,
6 with 0.1
μF ceramic chip capacitor. Do not connect to
Pins 11, 12.
REFHB (Pins 9, 10): ADC High Reference. Bypass to
Pins 11, 12 with 0.1
μF ceramic chip capacitor. Do not
connect to Pins 5, 6.
REFLA (Pins 11, 12): ADC Low Reference. Bypass to
Pins 9, 10 with 0.1
μF ceramic chip capacitor, to Pins 5, 6
with a 2.2
μF ceramic capacitor and to ground with 1μF
ceramic capacitor.
VDD (Pins 13, 14, 15, 62, 63): 3.3V Supply. Bypass to
GND with 0.1
μF ceramic chip capacitors.
GND (Pins 16, 61, 64): ADC Power Ground.
ENC+ (Pin 17): Encode Input. The input sample starts on
the positive edge.
ENC(Pin 18): Encode Complement Input. Conversion
starts on the negative edge. Bypass to ground with 0.1
μF
ceramic for single-ended ENCODE signal.
SHDN (Pin 19): Shutdown Mode Selection Pin. Connect-
ing SHDN to GND and OE to GND results in normal
operation with the outputs enabled. Connecting SHDN to
GND and OE to VDD results in normal operation with the
outputs at high impedance. Connecting SHDN to VDD and
OE to GND results in nap mode with the outputs at high
impedance. Connecting SHDN to VDD and OE to VDD
results in sleep mode with the outputs at high impedance.
OE (Pin 20): Output Enable Pin. Refer to SHDN pin
function.
DNC (Pins 21, 22, 23, 24): Do not connect these pins.
OGND (Pins 25, 33, 41, 50): Output Driver Ground.
OVDD (Pins 26, 34, 42, 49): Positive Supply for the
Output Drivers. Bypass to ground with 0.1
μF ceramic chip
capacitor.
D0/D0+ to D9/D9+ (Pins 27 to 32, 37 to 40, 43 to 48, 51
to 54): LVDS Digital Outputs. All LVDS outputs require
differential 100
Ω termination resistors at the LVDS re-
ceiver. D9/D9+ is the MBS.
UU
U
PI FU CTIO S
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