參數(shù)資料
型號(hào)： LTC2295IUP#PBF
廠商： Linear Technology
文件頁(yè)數(shù)： 10/24頁(yè)
文件大小： 0K
描述： IC ADC DUAL 14BIT 10MSPS 64QFN
標(biāo)準(zhǔn)包裝： 40
位數(shù)： 14
采樣率（每秒）： 10M
數(shù)據(jù)接口： 并聯(lián)
轉(zhuǎn)換器數(shù)目： 2
功率耗散（最大）： 138mW
電壓電源： 單電源
工作溫度： -40°C ~ 85°C
安裝類型： 表面貼裝
封裝/外殼： 64-WFQFN 裸露焊盤
供應(yīng)商設(shè)備封裝： 64-QFN（9x9）
包裝： 管件
輸入數(shù)目和類型： 2 個(gè)單端，雙極; 2 個(gè)差分, 雙極
LTC2295
2295fa
18
APPLICATIO S I FOR ATIO
WU
U
Digital Output Multiplexer
The digital outputs of the LTC2295 can be multiplexed onto
a single data bus. The MUX pin is a digital input that swaps
the two data busses. If MUX is High, Channel A comes out
on DA0-DA13, OFA; Channel B comes out on DB0-DB13,
OFB. If MUX is Low, the output busses are swapped and
Channel A comes out on DB0-DB13, OFB; Channel B comes
out on DA0-DA13, OFA. To multiplex both channels onto
a single output bus, connect MUX, CLKA and CLKB together
(see the Timing Diagram for the multiplexed mode). The
multiplexed data is available on either data bus—the un-
used data bus can be disabled with its OE pin.
Grounding and Bypassing
The LTC2295 requires a printed circuit board with a clean,
unbroken ground plane. A multilayer board with an inter-
nal ground plane is recommended. Layout for the printed
circuit board should ensure that digital and analog signal
lines are separated as much as possible. In particular, care
should be taken not to run any digital track alongside an
analog signal track or underneath the ADC.
High quality ceramic bypass capacitors should be used
at the VDD, OVDD, VCM, REFH, and REFL pins. Bypass
capacitors must be located as close to the pins as possible.
Of particular importance is the 0.1
F capacitor between
REFH and REFL. This capacitor should be placed as close
to the device as possible (1.5mm or less). A size 0402
ceramic capacitor is recommended. The large 2.2
F
capacitor between REFH and REFL can be somewhat
further away. The traces connecting the pins and bypass
capacitors must be kept short and should be made as wide
as possible.
The LTC2295 differential inputs should run parallel and
close to each other. The input traces should be as short as
possible to minimize capacitance and to minimize noise
pickup.
Heat Transfer
Most of the heat generated by the LTC2295 is transferred
from the die through the bottom-side exposed pad and
package leads onto the printed circuit board. For good
electrical and thermal performance, the exposed pad
should be soldered to a large grounded pad on the PC
board. It is critical that all ground pins are connected to a
ground plane of sufficient area.
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LTC2296CUP#PBF 功能描述:IC ADC DUAL 14BIT 25MSPS 64QFN RoHS:是 類別:集成電路 (IC) >> 數(shù)據(jù)采集 - 模數(shù)轉(zhuǎn)換器 系列:- 標(biāo)準(zhǔn)包裝:1 系列:microPOWER™ 位數(shù):8 采樣率（每秒）:1M 數(shù)據(jù)接口:串行，SPI? 轉(zhuǎn)換器數(shù)目:1 功率耗散（最大）:- 電壓電源:模擬和數(shù)字 工作溫度:-40°C ~ 125°C 安裝類型:表面貼裝 封裝/外殼:24-VFQFN 裸露焊盤 供應(yīng)商設(shè)備封裝:24-VQFN 裸露焊盤（4x4） 包裝:Digi-Reel® 輸入數(shù)目和類型:8 個(gè)單端，單極 產(chǎn)品目錄頁(yè)面:892 (CN2011-ZH PDF) 其它名稱:296-25851-6
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