Please refer to http://www.linear.com/designtools/packaging/
參數(shù)資料
型號: LTC2393IUK-16#TRPBF
廠商: Linear Technology
文件頁數(shù): 14/24頁
文件大?。?/td> 0K
描述: IC ADC 16BIT SER/PAR 1M 48-QFN
標(biāo)準(zhǔn)包裝: 2,000
位數(shù): 16
采樣率(每秒): 1M
數(shù)據(jù)接口: 串行,并聯(lián)
轉(zhuǎn)換器數(shù)目: 1
功率耗散(最大): 175mW
電壓電源: 模擬和數(shù)字
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 48-WFQFN 裸露焊盤
供應(yīng)商設(shè)備封裝: 48-QFN-EP(7x7)
包裝: 帶卷 (TR)
輸入數(shù)目和類型: 1 個差分,雙極
配用: DC1500A-A-ND - BOARD SAR ADC LTC2393-16
LTC2393-16
21
239316fa
PACKAGE DESCRIPTION
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.
7.00 ±0.10
(4 SIDES)
NOTE:
1. DRAWING CONFORMS TO JEDEC PACKAGE OUTLINE MO-220 VARIATION (WKKD-2)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE, IF PRESENT
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE
PIN 1 TOP MARK
(SEE NOTE 6)
PIN 1
CHAMFER
C = 0.35
0.40 ±0.10
48
47
1
2
BOTTOM VIEW—EXPOSED PAD
5.50 REF
(4-SIDES)
0.75 ±0.05
R = 0.115
TYP
0.25 ±0.05
0.50 BSC
0.200 REF
0.00 – 0.05
(UK48) QFN 0406 REV C
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
0.70 ±0.05
5.50 REF
(4 SIDES)
6.10 ±0.05 7.50 ±0.05
0.25 ±0.05
0.50 BSC
PACKAGE OUTLINE
5.15 ±0.10
5.15 ±0.05
R = 0.10
TYP
UK Package
48-Lead Plastic QFN (7mm
7mm)
(Reference LTC DWG # 05-08-1704 Rev C)
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