參數(shù)資料
型號(hào): LTC6082HGN#PBF
廠商: Linear Technology
文件頁(yè)數(shù): 7/20頁(yè)
文件大?。?/td> 0K
描述: IC AMP R-R QUAD I/O 16-SSOP
標(biāo)準(zhǔn)包裝: 100
放大器類(lèi)型: 通用
電路數(shù): 4
輸出類(lèi)型: 滿(mǎn)擺幅
轉(zhuǎn)換速率: 1 V/µs
增益帶寬積: 3.5MHz
電流 - 輸入偏壓: 0.2pA
電壓 - 輸入偏移: 70µV
電流 - 電源: 340µA
電流 - 輸出 / 通道: 21mA
電壓 - 電源,單路/雙路(±): 2.7 V ~ 5.5 V
工作溫度: -40°C ~ 125°C
安裝類(lèi)型: 表面貼裝
封裝/外殼: 16-SSOP(0.154",3.90mm 寬)
供應(yīng)商設(shè)備封裝: 16-SSOP
包裝: 管件
產(chǎn)品目錄頁(yè)面: 1322 (CN2011-ZH PDF)
LTC6081/LTC6082
15
60812fd
For more information www.linear.com/LTC6081
packaGe DescripTion
DD Package
10-Lead Plastic DFN (3mm
× 3mm)
(Reference LTC DWG # 05-08-1699 Rev C)
3.00
±0.10
(4 SIDES)
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-2).
CHECK THE LTC WEBSITE DATA SHEET FOR CURRENT STATUS OF VARIATION ASSIGNMENT
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
TOP AND BOTTOM OF PACKAGE
0.40
±0.10
BOTTOM VIEW—EXPOSED PAD
1.65
±0.10
(2 SIDES)
0.75
±0.05
R = 0.125
TYP
2.38
±0.10
(2 SIDES)
1
5
10
6
PIN 1
TOP MARK
(SEE NOTE 6)
0.200 REF
0.00 – 0.05
(DD) DFN REV C 0310
0.25
±0.05
2.38
±0.05
(2 SIDES)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
1.65
±0.05
(2 SIDES)
2.15
±0.05
0.50
BSC
0.70
±0.05
3.55
±0.05
PACKAGE
OUTLINE
0.25
±0.05
0.50 BSC
PIN 1 NOTCH
R = 0.20 OR
0.35
× 45°
CHAMFER
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.
相關(guān)PDF資料
PDF描述
TSW-136-23-G-D CONN HEADER 72POS .100" DL GOLD
77311-818-10LF CONN HEADER .100 SINGL STR 10POS
GTCR36-151M-R10 GAS TUBE 6MM 150V 20% RAD 10KA
PBC24DGBN CONN HEADER .100 DUAL R/A 48POS
PBC24DAHN CONN HEADER .100 DUAL STR 48POS
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