參數(shù)資料
型號(hào): LTC6082HGN#PBF
廠商: Linear Technology
文件頁(yè)數(shù): 9/20頁(yè)
文件大?。?/td> 0K
描述: IC AMP R-R QUAD I/O 16-SSOP
標(biāo)準(zhǔn)包裝: 100
放大器類型: 通用
電路數(shù): 4
輸出類型: 滿擺幅
轉(zhuǎn)換速率: 1 V/µs
增益帶寬積: 3.5MHz
電流 - 輸入偏壓: 0.2pA
電壓 - 輸入偏移: 70µV
電流 - 電源: 340µA
電流 - 輸出 / 通道: 21mA
電壓 - 電源,單路/雙路(±): 2.7 V ~ 5.5 V
工作溫度: -40°C ~ 125°C
安裝類型: 表面貼裝
封裝/外殼: 16-SSOP(0.154",3.90mm 寬)
供應(yīng)商設(shè)備封裝: 16-SSOP
包裝: 管件
產(chǎn)品目錄頁(yè)面: 1322 (CN2011-ZH PDF)
LTC6081/LTC6082
17
60812fd
For more information www.linear.com/LTC6081
packaGe DescripTion
GN16 REV B 0212
1 2 3 4 5 6 7 8
.229 – .244
(5.817 – 6.198)
.150 – .157**
(3.810 – 3.988)
16 15 14 13
.189 – .196*
(4.801 – 4.978)
12 11 10 9
.016 – .050
(0.406 – 1.270)
.015 ±.004
(0.38 ±0.10)
× 45°
0° – 8° TYP
.007 – .0098
(0.178 – 0.249)
.0532 – .0688
(1.35 – 1.75)
.008 – .012
(0.203 – 0.305)
TYP
.004 – .0098
(0.102 – 0.249)
.0250
(0.635)
BSC
.009
(0.229)
REF
.254 MIN
RECOMMENDED SOLDER PAD LAYOUT
.150 – .165
.0250 BSC
.0165 ±.0015
.045 ±.005
*DIMENSION DOES NOT INCLUDE MOLD FLASH. MOLD FLASH
SHALL NOT EXCEED 0.006" (0.152mm) PER SIDE
**DIMENSION DOES NOT INCLUDE INTERLEAD FLASH. INTERLEAD
FLASH SHALL NOT EXCEED 0.010" (0.254mm) PER SIDE
INCHES
(MILLIMETERS)
NOTE:
1. CONTROLLING DIMENSION: INCHES
2. DIMENSIONS ARE IN
3. DRAWING NOT TO SCALE
4. PIN 1 CAN BE BEVEL EDGE OR A DIMPLE
GN Package
16-Lead Plastic SSOP (Narrow .150 Inch)
(Reference LTC DWG # 05-08-1641 Rev B)
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.
相關(guān)PDF資料
PDF描述
TSW-136-23-G-D CONN HEADER 72POS .100" DL GOLD
77311-818-10LF CONN HEADER .100 SINGL STR 10POS
GTCR36-151M-R10 GAS TUBE 6MM 150V 20% RAD 10KA
PBC24DGBN CONN HEADER .100 DUAL R/A 48POS
PBC24DAHN CONN HEADER .100 DUAL STR 48POS
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