V+ DIV C1 0.1F R1 R2
參數(shù)資料
型號: LTC6994CDCB-1#TRMPBF
廠商: Linear Technology
文件頁數(shù): 13/26頁
文件大?。?/td> 0K
描述: IC DELAY LINE 6-DFN
產(chǎn)品培訓模塊: TimerBlox Family Timing Devices
產(chǎn)品目錄繪圖: LTC699_DFN
特色產(chǎn)品: TimerBlox?
標準包裝: 1
系列: TimerBlox®
功能: 可編程
可用的總延遲: 1µs ~ 33.6s
獨立延遲數(shù): 1
電源電壓: 2.25 V ~ 5.5 V
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 6-WFDFN 裸露焊盤
供應商設備封裝: 6-DFN-EP(2x3)
包裝: 標準包裝
配用: DC1562A-E-ND - BOARD EVAL LTC6992-3
其它名稱: LTC6994CDCB-1#TRMPBFDKR
LTC6994-1/LTC6994-2
20
699412fb
699412 F16
LTC6994
IN
GND
SET
OUT
V+
DIV
C1
0.1F
R1
R2
RSET
V+
DIV
SET
OUT
GND
IN
C1
R1
R2
V+
RSET
DCB PACKAGE
IN
GND
SET
OUT
V+
DIV
R2
V+
RSET
TSOT-23 PACKAGE
R1
C1
applicaTions inForMaTion
Figure 16. Supply Bypassing and PCB Layout
Supply Bypassing and PCB Layout Guidelines
TheLTC6994isanaccuratemonostablemultivibratorwhen
used in the appropriate manner. The part is simple to use
and by following a few rules, the expected performance is
easily achieved. Adequate supply bypassing and proper
PCB layout are important to ensure this.
Figure 16 shows example PCB layouts for both the SOT-23
and DCB packages using 0603 sized passive components.
The layouts assume a two layer board with a ground plane
layer beneath and around the LTC6994. These layouts are
a guide and need not be followed exactly.
1. Connect the bypass capacitor, C1, directly to the V+ and
GND pins using a low inductance path. The connection
from C1 to the V+ pin is easily done directly on the top
layer. For the DCB package, C1’s connection to GND is
also simply done on the top layer. For the SOT-23, OUT
can be routed through the C1 pads to allow a good C1
GND connection. If the PCB design rules do not allow
that,C1’sGNDconnectioncanbeaccomplishedthrough
multiple vias to the ground plane. Multiple vias for both
the GND pin connection to the ground plane and the
C1 connection to the ground plane are recommended
to minimize the inductance. Capacitor C1 should be a
0.1F ceramic capacitor.
2. Place all passive components on the top side of the
board. This minimizes trace inductance.
3. Place RSET as close as possible to the SET pin and make
adirect,shortconnection.TheSETpinisacurrentsum-
ming node and currents injected into this pin directly
modulate the output delay. Having a short connection
minimizes the exposure to signal pickup.
4. Connect RSET directly to the GND pin. Using a long path
or vias to the ground plane will not have a significant
affect on accuracy, but a direct, short connection is
recommended and easy to apply.
5. Use a ground trace to shield the SET pin. This provides
another layer of protection from radiated signals.
6. Place R1 and R2 close to the DIV pin. A direct, short
connection to the DIV pin minimizes the external signal
coupling.
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