Advance Data Sheet
March 1997
L8575
Dual-Resistive, Low-Cost SLIC
Lucent Technologies Inc.
19
Applications
(continued)
Protection
(continued)
The Tip/Ring drive amplifiers, which feed the ac signal
to nodes PR and PT, are high-impedance current driv-
ers. Since these nodes are current sources, the value
of protection current-limiting series resistance does not
affect the loop length or other SLIC performance, and
may be arbitrarily high for protection purposes.
Resistors R
7
and R
8
in the resistor module are used for
this purpose. These resistors have a value of 1.4 k
with a power rating 0.5 W. Internal diodes clamp nodes
PR and PT to ground and battery.
The voltage sense leads, RS and TS, are also exposed
to the outside plant. Current to these nodes is limited
by resistors R
3
and R
4
in the resistor module. Resistors
R
3
and R
4
are 100 k
, 250 mW resistors. Internal
diodes also clamp nodes RS and TS to ground and
battery.
The ability of the resistors to survive faults is a function
of the power dissipated in the individual resistors and
the total power dissipated on the entire thick film mod-
ule. Fault conditions include:
I
A continuous worst-case (fault detector) sneak under
condition of 39 Vdc applied metallically to Ring in the
case of a Ring ground fault, and
I
A sneak under condition of 39 Vp (voltage peak)
applied to Tip and Ring, as described in Bellcore
1089, ITU-T K20, etc., in the case of power cross.
Additionally, there is a transient fault condition, assum-
ing full specified power cross fault voltages (Bellcore
1089, ITU-T K20, etc.,) for a time duration equal to the
maximum response time that it will take to isolate the
line circuit from the fault via the fault detector and EMR
described above.
For example, a Ring ground fault assuming fault detec-
tor sneak under will result in a worst-case potential
across the R
1
of 39 V. The power dissipated in R
1
under
this condition is calculated as follows:
(39 V * 39 V)/300
= 5 W
Since this is a sneak under condition, the fault detector
will not trigger and the time duration of the fault can be
infinite. In the case of a longitudinally applied sneak
under power cross, the maximum voltage seen, this
time by both R
1
(Ring) and R
2
(Tip), is 39 Vp (voltage
peak). The power dissipation is given by:
Maximum Voltage = 39 Vp = 27.6 Vrms
Maximum Power = (27.6 Vrms * 27.6 Vrms)/(300
)
= 2.54 W per resistor.
Thus, 2.54 W will be dissipated per resistor or a total of
5.1 W in a longitudinal sneak under condition.
If R
1
and R
2
are rated for 2 W, they can fail under these
fault conditions. Also, the MMCA31A8575AA resistor
module includes a fail-safe thermal fuse located at the
Tip and Ring nodes (pin 1 and pin 19) of the module for
this reason. A fail-safe fuse is recommended for any
resistor module used with the L8575 SLIC.
With thick film technology, not only is the power capa-
bilities of the individual resistors important, but also the
power handling capabilities of the entire module. The
total module power dissipation is calculated by sum-
ming the power dissipation for each of the resistors
under a given condition.
For example, the module power dissipation for the
above sneak under fault conditions is calculated in
Table 11. Thus, the HIC will require a minimum power
rating of 6 W continuous to survive these sneak under
conditions.
Table 11. Total Module Power Dissipation
Resistor
(R)
Value
(
)
Ring Ground
Maximum dc
Fault Voltage (V)
39
0
29
0
39
0
39
0
Ring Ground
Maximum dc
Fault Power (W)
5.07
0
0.015
0
0.0076
0
1.086
0
6.18
Longitudinal
Fault Maximum
Peak Voltage (Vp)
39
39
39
39
39
39
39
39
—
Longitudinal Fault
Maximum rms
Voltage (Vrms)
27.577
27.577
27.577
27.577
27.577
27.577
27.577
27.577
—
Longitudinal
Fault Maximum
rms Power (W)
2.535
2.535
0.0076
0.0076
0.0038
0.0038
0.543
0.543
6.18
1
2
3
4
5
6
7
8
300
300
100 k
100 k
200 k
200 k
1.4 k
1.4 k
Total HIC Power: