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參數(shù)資料
| 型號(hào)： | M14C04DD |
| 廠商： | 意法半導(dǎo)體 |
| 英文描述： | M14C04 Die Description |
| 中文描述： | M14C04模具描述 |
| 文件頁數(shù)： | 11/13頁 |
| 文件大?。?/td> | 108K |
| 代理商： | M14C04DD |
11/13
M14C16, M14C04
Table 9. Ordering Information Scheme
Example:
M14C04
-
W
D20
Memory Capacity
Delivery Form
16
16 Kbit
D20
Module on Super 35 mm
film
04
4 Kbit
W2
Unsawn wafer (275
μ
m ±
25
μ
m thickness)
Unsawn wafer (180
μ
m ±
15
μ
m thickness)
W4
Operating Voltage
W
2.5 V to 5.5 V
S2x
Sawn wafer (275
μ
m ± 25
μ
m thickness)
Sawn wafer (180
μ
m ± 15
μ
m thickness)
S4x
where “x” indicates the sawing orientation, as follows (and as shown in Figure 11)
1
GND at top right
2
GND at bottom right
3
GND at bottom left
4
GND at top left
ORDERING INFORMATION
Devices are shipped from the factory with the
memory content set at all ‘1’s (FFh).
The notation used for the device number is as
shown in Table 9. For a list of available options
(speed, package, etc.) or for further information on
any aspect of this device, please contact the ST
Sales Office nearest to you.
Sawn wafers are scribed and mounted in a frame
on adhesive tape. The orientation is defined by the
position of the GND pad on the die, viewed with
active area of product visible, relative to the notch-
es of the frame (as shown in Figure 11). The orien-
tation of the die with respect to the plastic frame
notches is specified by the Customer.
One further concern, when specifying devices to
be delivered in this form, is that wafers mounted
on adhesive tape must be used within a limited pe-
riod from the mounting date:
– two months, if wafers are stored at 25°C, 55%
relative humidity
– six months, if wafers are stored at 4°C, 55% rel-
ative humidity
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| M14C04-WS23 | 制造商:STMICROELECTRONICS 制造商全稱:STMicroelectronics 功能描述:Memory Card IC 16/4 Kbit Serial IC Bus EEPROM |
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