2-18 Revision 13 Summary of I/O Timing Characteristics – Default I/O Software Settings
參數(shù)資料
型號(hào): M1A3PE3000L-1FG484I
廠商: Microsemi SoC
文件頁數(shù): 89/162頁
文件大?。?/td> 0K
描述: IC FPGA 1KB FLASH 3M 484-FBGA
標(biāo)準(zhǔn)包裝: 40
系列: ProASIC3EL
RAM 位總計(jì): 516096
輸入/輸出數(shù): 341
門數(shù): 3000000
電源電壓: 1.14V ~ 1.575 V
安裝類型: 表面貼裝
工作溫度: -40°C ~ 85°C
封裝/外殼: 484-BGA
供應(yīng)商設(shè)備封裝: 484-FPBGA(23x23)
ProASIC3E DC and Switching Characteristics
2-18
Revision 13
Summary of I/O Timing Characteristics – Default I/O Software
Settings
Table 2-15 Summary of AC Measuring Points
Standard
Input Reference Voltage
(VREF_TYP)
Board Termination
Voltage (VTT_REF)
Measuring Trip Point
(Vtrip)
3.3 V LVTTL / 3.3 V
LVCMOS
1.4 V
3.3 V LVCMOS Wide Range
1.4 V
2.5 V LVCMOS
1.2 V
1.8 V LVCMOS
0.90 V
1.5 V LVCMOS
0.75 V
3.3 V PCI
0.285 * VCCI (RR)
0.615 * VCCI (FF))
3.3 V PCI-X
0.285 * VCCI (RR)
0.615 * VCCI (FF)
3.3 V GTL
0.8 V
1.2 V
VREF
2.5 V GTL
0.8 V
1.2 V
VREF
3.3 V GTL+
1.0 V
1.5 V
VREF
2.5 V GTL+
1.0 V
1.5 V
VREF
HSTL (I)
0.75 V
VREF
HSTL (II)
0.75 V
VREF
SSTL2 (I)
1.25 V
VREF
SSTL2 (II)
1.25 V
VREF
SSTL3 (I)
1.5 V
1.485 V
VREF
SSTL3 (II)
1.5 V
1.485 V
VREF
LVDS
Cross point
LVPECL
Cross point
Table 2-16 I/O AC Parameter Definitions
Parameter
Definition
tDP
Data to Pad delay through the Output Buffer
tPY
Pad to Data delay through the Input Buffer with Schmitt trigger disabled
tDOUT
Data to Output Buffer delay through the I/O interface
tEOUT
Enable to Output Buffer Tristate Control delay through the I/O interface
tDIN
Input Buffer to Data delay through the I/O interface
tPYS
Pad to Data delay through the Input Buffer with Schmitt trigger enabled
tHZ
Enable to Pad delay through the Output Buffer—High to Z
tZH
Enable to Pad delay through the Output Buffer—Z to High
tLZ
Enable to Pad delay through the Output Buffer—Low to Z
tZL
Enable to Pad delay through the Output Buffer—Z to Low
tZHS
Enable to Pad delay through the Output Buffer with delayed enable—Z to High
tZLS
Enable to Pad delay through the Output Buffer with delayed enable—Z to Low
相關(guān)PDF資料
PDF描述
ASM43DRSD-S288 CONN EDGECARD 86POS .156 EXTEND
A3PE3000L-1FG484I IC FPGA 1KB FLASH 3M 484-FBGA
CAT24C256XI IC EEPROM 256KBIT 400KHZ 8SOIC
A3PE3000L-1FGG484I IC FPGA 1KB FLASH 3M 484-FBGA
EP1S25F1020C7N IC STRATIX FPGA 25K LE 1020-FBGA
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
M1A3PE3000L-1FG484M 制造商:Microsemi Corporation 功能描述:FPGA PROASIC?3EL FAMILY 3M GATES 130NM (CMOS) TECHNOLOGY 1.2 - Trays 制造商:Microsemi Corporation 功能描述:IC FPGA 341 I/O 484FBGA 制造商:Microsemi Corporation 功能描述:IC FPGA 3M GATES W/M1 484FBGA
M1A3PE3000L-1FG896 功能描述:IC FPGA 1KB FLASH 3M 896-FBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場(chǎng)可編程門陣列) 系列:ProASIC3EL 產(chǎn)品培訓(xùn)模塊:Three Reasons to Use FPGA's in Industrial Designs Cyclone IV FPGA Family Overview 特色產(chǎn)品:Cyclone? IV FPGAs 標(biāo)準(zhǔn)包裝:60 系列:CYCLONE® IV GX LAB/CLB數(shù):9360 邏輯元件/單元數(shù):149760 RAM 位總計(jì):6635520 輸入/輸出數(shù):270 門數(shù):- 電源電壓:1.16 V ~ 1.24 V 安裝類型:表面貼裝 工作溫度:0°C ~ 85°C 封裝/外殼:484-BGA 供應(yīng)商設(shè)備封裝:484-FBGA(23x23)
M1A3PE3000L-1FG896I 功能描述:IC FPGA 1KB FLASH 3M 896-FBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場(chǎng)可編程門陣列) 系列:ProASIC3EL 標(biāo)準(zhǔn)包裝:1 系列:ProASICPLUS LAB/CLB數(shù):- 邏輯元件/單元數(shù):- RAM 位總計(jì):129024 輸入/輸出數(shù):248 門數(shù):600000 電源電壓:2.3 V ~ 2.7 V 安裝類型:表面貼裝 工作溫度:- 封裝/外殼:352-BFCQFP,帶拉桿 供應(yīng)商設(shè)備封裝:352-CQFP(75x75)
M1A3PE3000L-1FG896M 制造商:Microsemi Corporation 功能描述:FPGA ProASIC?3EL Family 3M Gates 130nm Technology 1.2V/1.5V 896-Pin FBGA 制造商:Microsemi Corporation 功能描述:FPGA PROASIC?3EL FAMILY 3M GATES 130NM (CMOS) TECHNOLOGY 1.2 - Trays 制造商:Microsemi Corporation 功能描述:IC FPGA 3M GATES W/M1 896FBGA 制造商:Microsemi Corporation 功能描述:IC FPGA 620 I/O 896FBGA
M1A3PE3000L-1FGG144M 制造商:ACTEL 制造商全稱:Actel Corporation 功能描述:Military ProASIC3/EL Low-Power Flash FPGAs