3-4 Revision 13 Special Function Pins NC No Connect This pin is not connected to circuitry within the device. These" />
參數(shù)資料
型號(hào)： M1A3PE3000L-1FG896
廠商： Microsemi SoC
文件頁數(shù)： 3/162頁
文件大?。?/td> 0K
描述： IC FPGA 1KB FLASH 3M 896-FBGA
標(biāo)準(zhǔn)包裝： 27
系列： ProASIC3EL
RAM 位總計(jì)： 516096
輸入/輸出數(shù)： 620
門數(shù)： 3000000
電源電壓： 1.14V ~ 1.575 V
安裝類型： 表面貼裝
工作溫度： 0°C ~ 70°C
封裝/外殼： 896-BGA
供應(yīng)商設(shè)備封裝： 896-FBGA（31x31）
Pin Descriptions and Packaging
3-4
Revision 13
Special Function Pins
NC
No Connect
This pin is not connected to circuitry within the device. These pins can be driven to any voltage or can be
left floating with no effect on the operation of the device.
DC
Do Not Connect
This pin should not be connected to any signals on the PCB. These pins should be left unconnected.
Packaging
Semiconductor technology is constantly shrinking in size while growing in capability and functional
integration. To enable next-generation silicon technologies, semiconductor packages have also evolved
to provide improved performance and flexibility.
Microsemi consistently delivers packages that provide the necessary mechanical and environmental
protection to ensure consistent reliability and performance. Microsemi IC packaging technology
efficiently supports high-density FPGAs with large-pin-count Ball Grid Arrays (BGAs), but is also flexible
enough to accommodate stringent form factor requirements for Chip Scale Packaging (CSP). In addition,
Microsemi offers a variety of packages designed to meet your most demanding application and economic
requirements for today's embedded and mobile systems.
Related Documents
User’s Guides
Packaging
The following documents provide packaging information and device selection for low power flash
devices.
Lists devices currently recommended for new designs and the packages available for each member of
the family. Use this document or the datasheet tables to determine the best package for your design, and
which package drawing to use.
This document contains the package mechanical drawings for all packages currently or previously
supplied by Microsemi. Use the bookmarks to navigate to the package mechanical drawings.
相關(guān)PDF資料
PDF描述
RCB85DHAR CONN EDGECARD 170PS R/A .050 DIP
M1A3PE3000L-1FGG896 IC FPGA 1KB FLASH 3M 896-FBGA
EP4CE115F29C9L IC CYCLONE IV FPGA 115K 780-FBGA
HSC15DTES CONN EDGECARD 30POS .100 EYELET
EP4CE115F29C8 IC CYCLONE IV FPGA 115K 780-FBGA
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
M1A3PE3000L-1FG896I 功能描述:IC FPGA 1KB FLASH 3M 896-FBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場(chǎng)可編程門陣列） 系列:ProASIC3EL 標(biāo)準(zhǔn)包裝:1 系列:ProASICPLUS LAB/CLB數(shù):- 邏輯元件/單元數(shù):- RAM 位總計(jì):129024 輸入/輸出數(shù):248 門數(shù):600000 電源電壓:2.3 V ~ 2.7 V 安裝類型:表面貼裝 工作溫度:- 封裝/外殼:352-BFCQFP，帶拉桿 供應(yīng)商設(shè)備封裝:352-CQFP（75x75）
M1A3PE3000L-1FG896M 制造商:Microsemi Corporation 功能描述:FPGA ProASIC?3EL Family 3M Gates 130nm Technology 1.2V/1.5V 896-Pin FBGA 制造商:Microsemi Corporation 功能描述:FPGA PROASIC?3EL FAMILY 3M GATES 130NM (CMOS) TECHNOLOGY 1.2 - Trays 制造商:Microsemi Corporation 功能描述:IC FPGA 3M GATES W/M1 896FBGA 制造商:Microsemi Corporation 功能描述:IC FPGA 620 I/O 896FBGA
M1A3PE3000L-1FGG144M 制造商:ACTEL 制造商全稱:Actel Corporation 功能描述:Military ProASIC3/EL Low-Power Flash FPGAs
M1A3PE3000L-1FGG484 功能描述:IC FPGA 1KB FLASH 3M 484-FBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場(chǎng)可編程門陣列） 系列:ProASIC3EL 產(chǎn)品培訓(xùn)模塊:Three Reasons to Use FPGA's in Industrial Designs Cyclone IV FPGA Family Overview 特色產(chǎn)品:Cyclone? IV FPGAs 標(biāo)準(zhǔn)包裝:60 系列:CYCLONE® IV GX LAB/CLB數(shù):9360 邏輯元件/單元數(shù):149760 RAM 位總計(jì):6635520 輸入/輸出數(shù):270 門數(shù):- 電源電壓:1.16 V ~ 1.24 V 安裝類型:表面貼裝 工作溫度:0°C ~ 85°C 封裝/外殼:484-BGA 供應(yīng)商設(shè)備封裝:484-FBGA（23x23）
M1A3PE3000L-1FGG484I 功能描述:IC FPGA 1KB FLASH 3M 484-FBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場(chǎng)可編程門陣列） 系列:ProASIC3EL 標(biāo)準(zhǔn)包裝:1 系列:ProASICPLUS LAB/CLB數(shù):- 邏輯元件/單元數(shù):- RAM 位總計(jì):129024 輸入/輸出數(shù):248 門數(shù):600000 電源電壓:2.3 V ~ 2.7 V 安裝類型:表面貼裝 工作溫度:- 封裝/外殼:352-BFCQFP，帶拉桿 供應(yīng)商設(shè)備封裝:352-CQFP（75x75）
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