Revision 13 2-7 HSTL (I) 1.5 0.17 2.03 HSTL (II) 1.5 0.17 2.03 SSTL2 (I) 2.5 1.38 4.48 SSTL2 (II) 2.5 1.38 4.48 SSTL3" />
參數(shù)資料
型號: M1A3PE3000L-1FG896
廠商: Microsemi SoC
文件頁數(shù): 77/162頁
文件大?。?/td> 0K
描述: IC FPGA 1KB FLASH 3M 896-FBGA
標準包裝: 27
系列: ProASIC3EL
RAM 位總計: 516096
輸入/輸出數(shù): 620
門數(shù): 3000000
電源電壓: 1.14V ~ 1.575 V
安裝類型: 表面貼裝
工作溫度: 0°C ~ 70°C
封裝/外殼: 896-BGA
供應商設備封裝: 896-FBGA(31x31)
ProASIC3E Flash Family FPGAs
Revision 13
2-7
HSTL (I)
1.5
0.17
2.03
HSTL (II)
1.5
0.17
2.03
SSTL2 (I)
2.5
1.38
4.48
SSTL2 (II)
2.5
1.38
4.48
SSTL3 (I)
3.3
3.21
9.26
SSTL3 (II)
3.3
3.21
9.26
Differential
LVDS/B-LVDS/M-LVDS
2.5
2.26
1.50
LVPECL
3.3
5.71
2.17
Table 2-9 Summary of I/O Output Buffer Power (per pin) – Default I/O Software Settings 1
CLOAD
(pF)
VCCI
(V)
Static Power
PDC3 (mW)2
Dynamic Power
PAC10 (W/MHz)3
Single-Ended
3.3 V LVTTL/LVCMOS
35
3.3
474.70
3.3 V LVTTL/LVCMOS Wide Range4
35
3.3
474.70
2.5 V LVCMOS
35
2.5
270.73
1.8 V LVCMOS
35
1.8
151.78
1.5 V LVCMOS (JESD8-11)
35
1.5
104.55
3.3 V PCI
10
3.3
204.61
3.3 V PCI-X
10
3.3
204.61
Voltage-Referenced
3.3 V GTL
10
3.3
24.08
2.5 V GTL
10
2.5
13.52
3.3 V GTL+
10
3.3
24.10
2.5 V GTL+
10
2.5
13.54
HSTL (I)
20
1.5
7.08
26.22
HSTL (II)
20
1.5
13.88
27.22
SSTL2 (I)
30
2.5
16.69
105.56
SSTL2 (II)
30
2.5
25.91
116.60
Notes:
1. Dynamic power consumption is given for standard load and software default drive strength and output slew.
2. PDC3 is the static power (where applicable) measured on VCCI.
3. PAC10 is the total dynamic power measured on VCC and VCCI.
4. All LVCMOS 3.3 V software macros support LVCMOS 3.3 V wide range as specified in the JESD8-B specification.
Table 2-8 Summary of I/O Input Buffer Power (per pin) – Default I/O Software Settings (continued)
VMV
(V)
Static Power
PDC2 (mW)1
Dynamic Power
PAC9 (W/MHz)2
Notes:
1. PDC2 is the static power (where applicable) measured on VMV.
2. PAC9 is the total dynamic power measured on VCC and VMV.
3. All LVCMOS 3.3 V software macros support LVCMOS 3.3 V wide range as specified in the JESD8b specification.
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