參數(shù)資料
型號: M29DW324DT90ZA6F
廠商: STMICROELECTRONICS
元件分類: PROM
英文描述: 2M X 16 FLASH 3V PROM, 90 ns, PBGA63
封裝: 7 X 11 MM, 0.80 MM PITCH, LEAD FREE, TFBGA-63
文件頁數(shù): 15/50頁
文件大小: 878K
代理商: M29DW324DT90ZA6F
M29DW324DT, M29DW324DB
22/50
MAXIMUM RATING
Stressing the device above the rating listed in the
Absolute Maximum Ratings table may cause per-
manent damage to the device. Exposure to Abso-
lute Maximum Rating conditions for extended
periods may affect device reliability. These are
stress ratings only and operation of the device at
these or any other conditions above those indicat-
ed in the Operating sections of this specification is
not implied. Refer also to the STMicroelectronics
SURE Program and other relevant quality docu-
ments.
Table 9. Absolute Maximum Ratings
Note: 1. Compliant with the ECOPACK 7191395 specification for Lead-free soldering processes.
2. Not exceeding 250°C for more than 30s, and peaking at 260°C.
3. Minimum voltage may undershoot to –2V during transition and for less than 20ns during transitions.
4. Maximum voltage may overshoot to VCC +2V during transition and for less than 20ns during transitions.
5. VPP must not remain at 12V for more than a total of 80hrs.
Symbol
Parameter
Min
Max
Unit
TBIAS
Temperature Under Bias
–50
125
°C
TSTG
Storage Temperature
–65
150
°C
TLEAD
Lead Temperature during Soldering(1)
260(2)
°C
VIO
Input or Output Voltage (3,4)
–0.6
VCC +0.6
V
VCC
Supply Voltage
–0.6
4
V
VID
Identification Voltage
–0.6
13.5
V
VPP
(5)
Program Voltage
–0.6
13.5
V
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