參數(shù)資料
型號(hào)： M368L6523BUM-LCC
廠商： SAMSUNG SEMICONDUCTOR CO. LTD.
英文描述： DDR SDRAM Unbuffered Module 184pin Unbuffered Module based on 512Mb B-die with 64/72-bit Non ECC/ECC 66 TSOP-II
中文描述： DDR SDRAM的緩沖模塊184pin緩沖模塊基于512Mb乙芯片與64/72-bit非ECC / ECC的66 TSOP-II
文件頁(yè)數(shù)： 12/25頁(yè)
文件大?。?/td> 464K
代理商： M368L6523BUM-LCC
DDR SDRAM
256MB, 512MB, 1GB Unbuffered DIMM
Rev. 1.1 June 2005
Table of Contents
1.0 Ordering Information................................................................................................................... 4
2.0 Operating Frequencies................................................................................................................ 4
3.0 Feature.......................................................................................................................................... 4
4.0 Pin Configuration (Front side/back side) ................................................................................. 5
5.0 Pin Description ............................................................................................................................ 5
6.0 Functional Block Diagram .......................................................................................................... 6
6.1 256MB, 32M x 64 Non ECC Module (M368L3324BT(U)).....................................................................................
6
6.2 512MB, 64M x 64 Non ECC Module (M368L6523BT(U)) ....................................................................................
7
6.3 512MB, 64M x 72 ECC Module (M381L6523B(U)) ..............................................................................................
8
6.4 1GB, 128M x 64 Non ECC Module (M368L2923BT(U)) .......................................................................................
9
6.5 1GB, 128M x 72 ECC Module (M381L2923BT(U)) ...........................................................................................
10
7.0 Absolute Maximum Ratings...................................................................................................... 11
8.0 DC Operating Conditions.......................................................................................................... 11
9.0 DDR SDRAM IDD spec table ..................................................................................................... 12
9.1 M368L3324BT(U) [ (32M x 16) * 4, 256MB Non ECC Module ] ...............................................................................
12
9.2 M368L6523BT(U) [ (64M x 8) * 8, 512MB Non ECC Module ] .................................................................................
12
9.3 M381L6523BT(U) [ (64M x 8) * 9, 512MB ECC Module ] ..........................................................................................
13
9.4 M368L2923BT(U) [ (64M x 8) * 16, 1GB Non ECC Module ]....................................................................................
13
9.5 M381L2923BT(U) [ (64M x 8) * 18, 1GB ECC Module ] ............................................................................................
14
10.0 AC Operating Conditions........................................................................................................ 15
11.0 Input/Output Capacitance ....................................................................................................... 15
12.0 AC Timming Parameters & Specifications ............................................................................ 16
13.0 System Characteristics for DDR SDRAM .............................................................................. 17
14.0 Component Notes.................................................................................................................... 18
15.0 System Notes ........................................................................................................................... 19
16.0 Command Truth Table............................................................................................................. 20
17.0 Physical Dimensions............................................................................................................... 21
17.1 32M x 64 (M368L3324BT(U))
..................................................................................................... 21
17.2 64Mx64 (M368L6523BT(U))
....................................................................................................... 22
17.3 64Mx72 (M381L6523BT(U))
....................................................................................................... 23
17.4 128Mx64 (M368L2923BT(U))
..................................................................................................... 24
17.5 128Mx72 (M381L2923BT(U))
..................................................................................................... 25
相關(guān)PDF資料
PDF描述
M368L6523BUN-LB3 DDR SDRAM Unbuffered Module 184pin Unbuffered Module based on 512Mb B-die with 64/72-bit Non ECC/ECC 66 TSOP-II
M36L0T7050T0ZAQE 128Mbit (Multiple Bank, Multi-Level, Burst) Flash Memory 32Mbit (2M x16) PSRAM, Multi-Chip Package
M36L0T7050T0ZAQF 128Mbit (Multiple Bank, Multi-Level, Burst) Flash Memory 32Mbit (2M x16) PSRAM, Multi-Chip Package
M36L0T7050T0ZAQT 128Mbit (Multiple Bank, Multi-Level, Burst) Flash Memory 32Mbit (2M x16) PSRAM, Multi-Chip Package
M36L0T7050B0 128Mbit (Multiple Bank, Multi-Level, Burst) Flash Memory 32Mbit (2M x16) PSRAM, Multi-Chip Package
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
M368L6523BUN-CB3 制造商:SAMSUNG 制造商全稱:Samsung semiconductor 功能描述:DDR SDRAM Unbuffered Module 184pin Unbuffered Module based on 512Mb B-die with 64/72-bit Non ECC/ECC 66 TSOP-II
M368L6523BUN-LB3 制造商:SAMSUNG 制造商全稱:Samsung semiconductor 功能描述:DDR SDRAM Unbuffered Module 184pin Unbuffered Module based on 512Mb B-die with 64/72-bit Non ECC/ECC 66 TSOP-II
M368L6523CUS 制造商:SAMSUNG 制造商全稱:Samsung semiconductor 功能描述:DDR SDRAM Unbuffered Module
M368L6523CUS-CCC 制造商:SAMSUNG 制造商全稱:Samsung semiconductor 功能描述:DDR SDRAM Unbuffered Module
M368L6523DUS 制造商:SAMSUNG 制造商全稱:Samsung semiconductor 功能描述:DDR SDRAM Product Guide
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