參數(shù)資料
型號: M36L0R7040T0ZAQE
廠商: 意法半導體
英文描述: 128 Mbit (Multiple Bank, Multi-Level, Burst) Flash Memory and 16 Mbit PSRAM, 1.8V Supply, Multi-Chip Package
中文描述: 128兆位(多銀行,多層次,突發(fā))閃存和16兆移動存儲芯片,1.8V電源,多芯片封裝
文件頁數(shù): 16/18頁
文件大?。?/td> 119K
代理商: M36L0R7040T0ZAQE
M36L0R7040T0, M36L0R7040B0
16/18
PART NUMBERING
Table 10. Ordering Information Scheme
Devices are shipped from the factory with the memory content bits erased to ’1’. For a list of available op-
tions (Speed, Package, etc.) or for further information on any aspect of this device, please contact the ST-
Microelectronics Sales Office nearest to you.
Example:
M36 L 0 R 7 0 4 0 T 0 ZAQ T
Device Type
M36 = Multi-Chip Package (Flash + RAM)
Flash 1 Architecture
L = Multilevel, Multiple Bank, Burst mode
Flash 2 Architecture
0 = No Die
Operating Voltage
R = V
DDF
= V
DDP
= V
DDQ
= 1.7 to 1.95V
Flash 1 Density
7 = 128 Mbit
Flash 2 Density
0 = No Die
RAM 1 Density
4 = 16 Mbit
RAM 0 Density
0 = No Die
Parameter Blocks Location
T = Top Boot Block Flash
B = Bottom Boot Block Flash
Product Version
0 = 0.13μm Flash technology, 85ns speeds;
0.18μm RAM, 70ns speed
Package
ZAQ = Stacked TFBGA88 8x10mm - 8x10 active ball array, 0.8mm pitch
Option
Blank = Standard Packing
T = Tape & Reel Packing
E = Lead-free and RoHS package, standard packing
F= Lead-free and RoHS package, tape and reel packing
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相關代理商/技術參數(shù)
參數(shù)描述
M36L0R7040T0ZAQF 制造商:STMICROELECTRONICS 制造商全稱:STMicroelectronics 功能描述:128 Mbit (Multiple Bank, Multi-Level, Burst) Flash Memory and 16 Mbit PSRAM, 1.8V Supply, Multi-Chip Package
M36L0R7040T0ZAQT 制造商:STMICROELECTRONICS 制造商全稱:STMicroelectronics 功能描述:128 Mbit (Multiple Bank, Multi-Level, Burst) Flash Memory and 16 Mbit PSRAM, 1.8V Supply, Multi-Chip Package
M36L0R7040U1Z85U 制造商:STMicroelectronics 功能描述:
M36L0R7040U3ZA5U 制造商:Micron Technology Inc 功能描述:MCP - Tape and Reel
M36L0R7040U4ZA5U 制造商:Micron Technology Inc 功能描述:8MX16/1MX16 MCP PLASTIC PBF VFBGA 1.8V COMBO - Tape and Reel