參數(shù)資料
型號: M36P0R9070E0ZAC
廠商: 意法半導(dǎo)體
英文描述: 512 Mbit (x16, Multiple Bank, Multi-Level, Burst) Flash Memory 128 Mbit (Burst) PSRAM, 1.8V Supply, Multi-Chip Package
中文描述: 512兆位(x16插槽,多銀行,多層次,多突發(fā))128兆位閃存(突發(fā))移動存儲芯片,1.8V電源,多芯片封裝
文件頁數(shù): 9/26頁
文件大小: 200K
代理商: M36P0R9070E0ZAC
M36P0R9070E0
2 Signal descriptions
9/26
2
Signal descriptions
See
Table 1., Logic Diagram
and
Table 2., Signal Names
, for a brief overview of the signals
connected to this device.
2.1
Address inputs (A0-A24)
Addresses A0-A22 are common inputs for the Flash memory and PSRAM components.
Addresses A23 and A24 are inputs for Flash memory components only. The Address Inputs
select the cells in the memory array to access during Bus Read operations. During Bus Write
operations they control the commands sent to the Command Interface of the internal state
machine. The Flash memory is accessed through the Chip Enable signal (E
F
) and through the
Write Enable signal (W
F
), while the PSRAM is accessed through the Chip Enable signal (E
P
)
and the Write Enable signal (W
P
).
E
F
Low, and E
P
must not be Low at the same time.
2.2
Data input/output (DQ0-DQ15)
The Data I/O output the data stored at the selected address during a Bus Read operation or
input a command or the data to be programmed during a Bus Write operation.
For the PSRAM component, the upper Byte Data Inputs/Outputs (DQ8-DQ15) carry the data to
or from the upper part of the selected address when Upper Byte Enable (UB
P
) is driven Low.
The lower Byte Data Inputs/Outputs (DQ0-DQ7) carry the data to or from the lower part of the
selected address when Lower Byte Enable (LB
P
) is driven Low. When both UB
P
and LB
P
are
disabled, the Data Inputs/ Outputs are high impedance.
2.3
Latch Enable (L)
The Latch Enable pin is common to the Flash memory and PSRAM components.
For details of how the Latch Enable signal behaves, please refer to the datasheets of the
respective memory components: M69KB128AA for the PSRAM and M58PR512J for the Flash
memory.
2.4
Clock (K)
The Clock input pin is common to the Flash memory and PSRAM components.
For details of how the Clock signal behaves, please refer to the datasheets of the respective
memory components: M69KB128AA for the PSRAM and M58PR512J for the Flash memory.
相關(guān)PDF資料
PDF描述
M36P0R9070E0ZACE 512 Mbit (x16, Multiple Bank, Multi-Level, Burst) Flash Memory 128 Mbit (Burst) PSRAM, 1.8V Supply, Multi-Chip Package
M36P0R9070E0ZACF 512 Mbit (x16, Multiple Bank, Multi-Level, Burst) Flash Memory 128 Mbit (Burst) PSRAM, 1.8V Supply, Multi-Chip Package
M36W0R6030B0 64 Mbit (4Mb x16, Multiple Bank, Burst) Flash Memory and 8 Mbit (512Kb x16) SRAM, Multi-Chip Package
M36W0R6030B0ZAQ 64 Mbit (4Mb x16, Multiple Bank, Burst) Flash Memory and 8 Mbit (512Kb x16) SRAM, Multi-Chip Package
M36W0R6030B0ZAQE 64 Mbit (4Mb x16, Multiple Bank, Burst) Flash Memory and 8 Mbit (512Kb x16) SRAM, Multi-Chip Package
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
M36P0R9070E0ZACE 制造商:Micron Technology Inc 功能描述:WIRELESS - Trays
M36P0R9070E0ZACF 制造商:Micron Technology Inc 功能描述:WIRELESS - Tape and Reel
M36P0R9070E1ZACE 制造商:Micron Technology Inc 功能描述:WIRELESS - Trays
M36P0R9070E1ZACF 制造商:Micron Technology Inc 功能描述:WIRELESS - Tape and Reel
M36P0R9070N1ZSE 制造商:Micron Technology Inc 功能描述:WIRELESS - Trays