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參數(shù)資料
| 型號： | MA4SPS402 |
| 英文描述： | Surface Mount Monolithic PIN Diode Chip |
| 中文描述： | 表面貼裝芯片單片PIN二極管 |
| 文件頁數(shù)： | 2/3頁 |
| 文件大小： | 50K |
| 代理商： | MA4SPS402 |
n
North America:
Tel. (800) 366-2266, Fax (800) 618-8883
n
Asia/Pacific:
Tel.+81-44-844-8296, Fax +81-44-844-8298
n
Europe:
Tel. +44 (1344) 869 595, Fax+44 (1344) 300 020
Specifications subject to change without notice.
Visit www.macom.com for additional data sheets and product information.
V 2.0
Handling Procedures
All semiconductor chips should be handled with care to avoid
damage or contamination from perspiration and skin oils. The
use of plastic tipped tweezers or vacuum pickups is strongly
recommended for individual components. Bulk handling should
insure that abrasion and mechanical shock are minimized.
ESD
These devices very susceptible to ESD and are rated Class 0
(0-199V) per HBM MIL-STD-883, method 3015.7 [C = 100pF
±
10%, R = 1.5k
±
1%]. Even though tested die pass 100V
ESD, they must be handled in a static-free environment.
Bonding Techniques
Attachment to a circuit board is made simple through the use of
surface mount technology. Mounting pads are conveniently
located on the bottom surface of these diodes and are removed
from the active junction locations. These diodes are well suited
for solder attachment onto hard and soft substrates. The use of
80/20 Au/Sn and 60/40 Sn/Pb solder is recommended.
Conductive epoxy paste for attachment may also be used, this
can be silk-screened, or used with a conductive sheet apoxy.
When soldering these diodes to a hard substrate, hot gas die
bonding is preferred. We recommend utilizing a vacuum tip and
a force of 60 to 100 grams applied normal to the top surface of
the part. When soldering to soft substrates, it is recommended
to use a lead-tin interface at the circuit board mounting pads.
Position the die so that its mounting pads are aligned with the
circuit board’s mounting pads Reflow the solder by heating the
circuit trace near the mounting pad while applying 60 to 100
grams of force perpendicular to the top surface of the die.
Since the HMIC glass is transparent, the edges of the
mounting pads closest to each other can be visually inspected
through the die after attach is completed.
Surface Mount Monolithic PIN Diode Chip
MA4SPS402 SurMount
Series
Electrical Specifications @ +25°C
Symbol
Test Conditions
Units
Min.
Typ.
Max.
C
T
-40 Volts, 1 MHz
1
pF
0.034
0.045
C
T
-40 Volts, 1 GHz
1, 3
pF
0.041
R
S
10 mA, 2 MHz
2
5.0
R
S
10 mA, 100 MHz
2
4.6
R
S
10 mA, 1 GHz
2, 3
5.0
V
F
1.0 mA
V
0.84
1.00
V
R
10
μ
A
V
-70
-120
I
R
-70V
μ
A
10
T
L
10 mA / 6 mA
ns
200
1. Total capacitance is equivalent to the sum of junction capacitance C
and parasitic capacitance.
2. Series resistance R
is equivalent to the total diode series resistance including the junction resistance R
.
3. R
S
and C
P
is measured on an HP4291A with die mounted in an ODS-186 package with conductive silver epoxy.
Functional Schematic
1
Rp
Cp
Ls
Rvia
Rvia
+
-
1. Rs = 2 * Rvia + Rp
2
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| MA4SPS402_1 | 制造商:MA-COM 制造商全稱:M/A-COM Technology Solutions, Inc. 功能描述:SURMOUNT PIN Diode |
| MA4SPS402_V6 | 制造商:MA-COM 制造商全稱:M/A-COM Technology Solutions, Inc. 功能描述:SURMOUNTTM PIN Diode RoHS Compliant |
| MA4SPS402-T | 制造商:M/A-COM Technology Solutions 功能描述:SURMOUNT PIN DIODE - LOW CT T/R - Tape and Reel 制造商:M/A-COM Technology Solutions 功能描述:RF PIN DIODE |
| MA4SPS402-W | 制造商:M/A-COM Technology Solutions 功能描述:SURMOUNT PIN DIODE - LOW CT - Bulk |
| MA4SPS42 | 制造商:MA-COM 制造商全稱:M/A-COM Technology Solutions, Inc. 功能描述:SURMOUNT PIN Diodes |
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