Surface Mount Monolithic PIN Diode Chip
MA4SPS502 SurMount
TM
Series
Specifications subject to change without notice.
n
North America:
Tel. (800) 366-2266
n
Asia/Pacific:
Tel.+81-44-844-8296, Fax +81-44-844-8298
n
Europe:
Tel. +44 (1344) 869 595, Fax+44 (1344) 300 020
Visit www.macom.com for additional data sheets and product information.
Electrical Specifications: @ 25 °C
Symbol
Test Conditions
Units
Min.
Typ.
Max.
C
T
-40 Volts, 1 MHz
pF
0.140
0.200
C
T
-40 Volts, 1 GHz
pF
0.090
R
S
100 mA, 100 MHz
1.4
R
S
20 mA, 100 MHz
2.4
V
F
100 mA
V
1.24
1.50
V
F
10 mA
V
0.87
1.00
V
R
10
μ
A
V
-300
-330
I
R
-300 V
μ
A
10
I
R
-40 V
nA
8
R
θ
JL
Steady state
°C/W
75
T
L
+10 mA / -6 mA measured at 90% voltage
μs
2.8
2
Handling Procedures
All semiconductor chips should be handled with care to avoid
damage or contamination from perspiration and skin oils. The
use of plastic tipped tweezers or vacuum pickups is strongly
recommended for individual components. Bulk handling should
insure that abrasion and mechanical shock are minimized.
Bonding Techniques
Attachment to a circuit board is made simple through the use of
surface mount technology. Mounting pads are conveniently
located on the bottom surface of these diodes and are removed
from the active junction locations. These devices are well suited
for solder attachment onto hard and soft substrates. The use of
80/20 Au/Sn and 60/40 Sn/Pb solder is recommended, with an
equal temperature profile across the contacts. Conductive epoxy
paste for attachment may also be used.
When soldering these devices to a hard substrate, hot gas die
bonding is preferred. We recommend utilizing a vacuum tip and
a force of 60 to 100 grams applied normal to the top surface of
the device. When soldering to soft substrates, it is recommended
to use a lead-tin interface at the circuit board mounting pads.
Position the die so that its mounting pads are aligned with the
circuit board’s mounting pads and reflow the solder by heating
the circuit trace near the mounting pad while applying 60 to 100
grams of force perpendicular to the top surface of the die.
Since the HMIC glass is transparent, the edges of the mounting
pads closest to each other can be visually inspected through the
die after attach is completed.
Functional Schematic
1
Rp
Cp
Ls
Rvia
Rvia
+
-
1. Rs = 2 * Rvia + Rp