參數(shù)資料
型號： MAC7101MAG40
廠商： Freescale Semiconductor
文件頁數(shù)： 2/56頁
文件大小： 0K
描述： IC MCU 32BIT FLASH 144-LQFP
標(biāo)準(zhǔn)包裝： 60
系列： MAC7xxx
核心處理器： ARM7
芯體尺寸： 32-位
速度： 40MHz
連通性： CAN，I²C，SCI，SPI
外圍設(shè)備： DMA，POR
輸入/輸出數(shù)： 112
程序存儲器容量： 544KB（544K x 8）
程序存儲器類型： 閃存
RAM 容量： 32K x 8
電壓 - 電源 (Vcc/Vdd)： 2.35 V ~ 5.5 V
數(shù)據(jù)轉(zhuǎn)換器： A/D 32x8/10b
振蕩器型： 內(nèi)部
工作溫度： -40°C ~ 125°C
封裝/外殼： 144-LQFP
包裝： 托盤
MAC7100 Microcontroller Family Hardware Specifications, Rev. 1.2
Preliminary
Electrical Characteristics
Freescale Semiconductor
10
3.6.1
Thermal Resistance Simulation Details
Comments:
1. Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board) temperature,
ambient temperature, air flow, power dissipation of other components on the board, and board thermal resistance.
2. Per SEMI G38-87 and JEDEC JESD51-2 with the single layer board (JESD51-3) horizontal.
3. Per JEDEC JESD51-6 with the board (JESD51-7) horizontal.
4. Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on the top surface
of the board at the center lead. For fused lead packages, the adjacent lead is used.
5. Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method 1012.1).
6. Thermal characterization parameter indicating the temperature difference between package top and junction temperature per JEDEC
JESD51-2. When Greek letters are not available, the thermal characterization parameter is written as Psi-JT.
Table 11. Thermal Resistance for Case Outline 983–02, 100 Lead 14x14 mm LQFP, 0.5 mm Pitch
Rating
Environment
Symbol
Value
Unit
Comments
Junction to Ambient (Natural Convection)
Single layer board (1s)
R
θJA
44
°C/W
1, 2
Junction to Ambient (Natural Convection)
Four layer board (2s2p)
R
θJMA
34
°C/W
1, 3
Junction to Ambient (@ 200 ft./min.)
Single layer board (1s)
R
θJMA
37
°C/W
1, 3
Junction to Ambient (@ 200 ft./min.)
Four layer board (2s2p)
R
θJMA
29
°C/W
1, 3
Junction to Board
R
θJB
18
°C/W
Junction to Case
R
θJC
7°C/W
Junction to Package Top
Natural Convection
ΨJT
2°C/W
Table 12. Thermal Resistance for Case Outline 987–01, 112 Lead 20x20 mm LQFP, 0.65 mm Pitch
Rating
Environment
Symbol
Value
Unit
Comments
Junction to Ambient (Natural Convection)
Single layer board (1s)
R
θJA
42
°C/W
1, 2
Junction to Ambient (Natural Convection)
Four layer board (2s2p)
R
θJMA
34
°C/W
1, 3
Junction to Ambient (@ 200 ft./min.)
Single layer board (1s)
R
θJMA
35
°C/W
1, 3
Junction to Ambient (@ 200 ft./min.)
Four layer board (2s2p)
R
θJMA
30
°C/W
1, 3
Junction to Board
R
θJB
22
°C/W
Junction to Case
R
θJC
7°C/W
Junction to Package Top
Natural Convection
ΨJT
2°C/W
Table 13. Thermal Resistance for Case Outline 918–03, 144 Lead 20x20 mm LQFP, 0.5 mm Pitch
Rating
Environment
Symbol
Value
Unit
Comments
Junction to Ambient (Natural Convection)
Single layer board (1s)
R
θJA
42
°C/W
1, 2
Junction to Ambient (Natural Convection)
Four layer board (2s2p)
R
θJMA
34
°C/W
1, 3
Junction to Ambient (@ 200 ft./min.)
Single layer board (1s)
R
θJMA
35
°C/W
1, 3
Junction to Ambient (@ 200 ft./min.)
Four layer board (2s2p)
R
θJMA
30
°C/W
1, 3
Junction to Board
R
θJB
22
°C/W
Junction to Case
R
θJC
7°C/W
Junction to Package Top
Natural Convection
ΨJT
2°C/W
Table 14. Thermal Resistance for Case Outline 1159A-01, 208 Lead 17x17 mm MAP BGA, 1.0 mm Pitch
Rating
Environment
Symbol
Value
Unit
Comments
Junction to Ambient (Natural Convection)
Single layer board (1s)
R
θJA
46
°C/W
1, 2
Junction to Ambient (Natural Convection)
Four layer board (2s2p)
R
θJMA
29
°C/W
1, 3
Junction to Ambient (@ 200 ft./min.)
Single layer board (1s)
R
θJMA
38
°C/W
1, 3
Junction to Ambient (@ 200 ft./min.)
Four layer board (2s2p)
R
θJMA
26
°C/W
1, 3
Junction to Board
R
θJB
19
°C/W
Junction to Case
R
θJC
7°C/W
Junction to Package Top
Natural Convection
ΨJT
2°C/W
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