參數(shù)資料
型號： MAC7131MVF50
廠商： MOTOROLA INC
元件分類： 微控制器/微處理器
英文描述： 32-BIT, FLASH, 50 MHz, RISC MICROCONTROLLER, PBGA208
封裝： 17 X 17 MM, 1 MM PITCH, MAPBGA-208
文件頁數(shù)： 47/48頁
文件大?。?/td> 1282K
代理商： MAC7131MVF50
8
MAC7100 Microcontroller Family Hardware Specifications
MOTOROLA
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
Electrical Characteristics
3.6
Power Supply
The MAC7100 Family utilizes several pins to supply power to the oscillator, PLL, digital core, I/O ports
and ATD. In the context of this section, VDD5 is used for VDDA, VDDR or VDDX; VSS5 is used for VSSA,
VSSR or VSSX unless otherwise noted. IDD5 denotes the sum of the currents flowing into the VDDA, VDDX,
and VDDR. VDD is used for VDD2.5, and VDDPLL, VSS is used for VSS2.5 and VSSPLL. IDD is used for the
sum of the currents flowing into VDD2.5 and VDDPLL.
3.6.1
Current Injection
The power supply must maintain regulation within the VDD5 or VDD2.5 operating range during
instantaneous and operating maximum current conditions. If positive injection current (Vin > VDD5) is
greater than IDD5, the injection current may flow out of VDD5 and could result in the external power supply
going out of regulation. It is important to ensure that the external VDD5 load will shunt current greater than
the maximum injection current. The greatest risk will be when the MCU is consuming very little power (for
example, if no system clock is present, or if the clock rate is very low).
3.6.2
Power Supply Pins
The VDDR – VSSR pair supplies the internal voltage regulator. The VDDA – VSSA pair supplies the A/D
converter and the reference circuit of the internal voltage regulator. The VDDX – VSSX pair supplies the I/O
pins. VDDPLL – VSSPLL pair supplies the oscillator and PLL.
All VDDX pins are internally connected by metal. All VSSX pins are internally connected by metal. All
VSS2.5 pins are internally connected by metal. VDDA, VDDX and VDDR as well as VSSA, VSSX and VSSR
are connected by anti-parallel diodes for ESD protection.
3.6.3
Supply Currents
All current measurements are without output loads. Unless otherwise noted the currents are measured in
single chip mode, internal voltage regulator enabled and at 40MHz bus frequency using a 4MHz oscillator
in low power mode. Production testing is performed using a square wave signal at the EXTAL input.
In expanded modes, the currents flowing in the system are highly dependent on the load at the address, data
and control signals as well as on the duty cycle of those signals. No generally applicable numbers can be
given. A good estimate is to take the single chip currents and add the currents due to the external loads.
Table 11. Power Dissipation 1/8 Simulation Model Packaging Parameters
Component
Conductivity
Mold Compound
0.9 W/m K
Leadframe (Copper)
263 W/m K
Die Attach
1.7 W/m K
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
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