參數(shù)資料
型號： MAC7141CFU50
廠商： MOTOROLA INC
元件分類： 微控制器/微處理器
英文描述： 32-BIT, FLASH, 50 MHz, RISC MICROCONTROLLER, PQFP100
封裝： 14 X 14 MM, LQFP-100
文件頁數(shù)： 46/48頁
文件大?。?/td> 1282K
代理商： MAC7141CFU50
MOTOROLA
MAC7100 Microcontroller Family Hardware Specifications
7
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
ElectricalCharacteristics
3.5.1
Power Dissipation Simulation Details
Comments:
1. Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)
temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal resistance.
2. Per SEMI G38-87 and JEDEC JESD51-2 with the single layer board (JESD51-3) horizontal.
3. Per JEDEC JESD51-6 with the board (JESD51-7) horizontal.
4. Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on the top
surface of the board at the center lead. For fused lead packages, the adjacent lead is used.
5. Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method 1012.1).
6. Thermal characterization parameter indicating the temperature difference between package top and junction temperature per JEDEC
JESD51-2. When Greek letters are not available, the thermal characterization parameter is written as Psi-JT.
Table 7. Thermal Resistance for 100 lead 14x14 mm LQFP, 0.5 mm Pitch 1
1 100 LQFP, Case Outline: 983–02
Rating
Value
Unit
Comments
Junction to Ambient (Natural Convection)
Single layer board (1s)
RθJA
44
°C/W
1, 2
Junction to Ambient (Natural Convection)
Four layer board (2s2p)
RθJMA
34
°C/W
1, 3
Junction to Ambient (@ 200 ft./min.)
Single layer board (1s)
RθJMA
37
°C/W
1, 3
Junction to Ambient (@ 200 ft./min.)
Four layer board (2s2p)
RθJMA
29
°C/W
1, 3
Junction to Board
RθJB
18
°C/W
4
Junction to Case
RθJC
7°C/W
5
Junction to Package Top
Natural Convection
ΨJT
2°C/W
6
Table 8. Thermal Resistance for 112 lead 20x20 mm LQFP, 0.65 mm Pitch 1
1 112 LQFP, Case Outline: 987–01
Rating
Value
Unit
Comments
Junction to Ambient (Natural Convection)
Single layer board (1s)
RθJA
42
°C/W
1, 2
Junction to Ambient (Natural Convection)
Four layer board (2s2p)
RθJMA
34
°C/W
1, 3
Junction to Ambient (@ 200 ft./min.)
Single layer board (1s)
RθJMA
35
°C/W
1, 3
Junction to Ambient (@ 200 ft./min.)
Four layer board (2s2p)
RθJMA
30
°C/W
1, 3
Junction to Board
RθJB
22
°C/W
4
Junction to Case
RθJC
7°C/W
5
Junction to Package Top
Natural Convection
ΨJT
2°C/W
6
Table 9. Thermal Resistance for 144 lead 20x20 mm LQFP, 0.5 mm Pitch 1
1 144 LQFP, Case Outline: 918–03
Rating
Value
Unit
Comments
Junction to Ambient (Natural Convection)
Single layer board (1s)
RθJA
42
°C/W
1, 2
Junction to Ambient (Natural Convection)
Four layer board (2s2p)
RθJMA
34
°C/W
1, 3
Junction to Ambient (@ 200 ft./min.)
Single layer board (1s)
RθJMA
35
°C/W
1, 3
Junction to Ambient (@ 200 ft./min.)
Four layer board (2s2p)
RθJMA
30
°C/W
1, 3
Junction to Board
RθJB
22
°C/W
4
Junction to Case
RθJC
7°C/W
5
Junction to Package Top
Natural Convection
ΨJT
2°C/W
6
Table 10. Thermal Resistance for 208 lead 17x17 mm MAP, 1.0 mm Pitch 1
1 208 MAP BGA, Case Outline: 1159A-01
Rating
Value
Unit
Comments
Junction to Ambient (Natural Convection)
Single layer board (1s)
RθJA
46
°C/W
1, 2
Junction to Ambient (Natural Convection)
Four layer board (2s2p)
RθJMA
29
°C/W
1, 3
Junction to Ambient (@ 200 ft./min.)
Single layer board (1s)
RθJMA
38
°C/W
1, 3
Junction to Ambient (@ 200 ft./min.)
Four layer board (2s2p)
RθJMA
26
°C/W
1, 3
Junction to Board
RθJB
19
°C/W
4
Junction to Case
RθJC
7°C/W
5
Junction to Package Top
Natural Convection
ΨJT
2°C/W
6
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