參數(shù)資料
型號： MAX199BEWI+T
廠商： Maxim Integrated Products
文件頁數(shù)： 7/16頁
文件大小： 0K
描述： IC DAS 12BIT 8CH 28-SOIC
產(chǎn)品培訓(xùn)模塊： Lead (SnPb) Finish for COTS
Obsolescence Mitigation Program
標(biāo)準(zhǔn)包裝： 1,000
類型： 數(shù)據(jù)采集系統(tǒng)（DAS）
分辨率（位）： 12 b
采樣率（每秒）： 100k
數(shù)據(jù)接口： 并聯(lián)
電壓電源： 單電源
電源電壓： 4.75 V ~ 5.25 V
工作溫度： -40°C ~ 85°C
安裝類型： 表面貼裝
封裝/外殼： 28-SOIC（0.295"，7.50mm 寬）
供應(yīng)商設(shè)備封裝： 28-SOIC W
包裝： 帶卷 (TR)
Transfer Function
Output data coding for the MAX199 is binary in unipolar
mode with 1LSB = (FS / 4096) and twos-complement
binary in bipolar mode with 1LSB = [(2 x
|FS|) / 4096].
Code transitions occur halfway between successive-
integer LSB values. Figures 10 and 11 show the
input/output (I/O) transfer functions for unipolar and
bipolar operations, respectively.
Layout, Grounding, and Bypassing
Careful printed circuit board layout is essential for best
system performance. For best performance, use a
ground plane. To reduce crosstalk and noise injection,
keep analog and digital signals separate. Digital
ground lines can run between digital signal lines to
minimize interference. Connect analog grounds and
DGND in a star configuration to AGND. For noise-free
operation, ensure the ground return from AGND to the
supply ground is low impedance and as short as possi-
ble. Connect the logic grounds directly to the supply
ground. Bypass VDD with 0.1F and 4.7F capacitors
to AGND to minimize high- and low-frequency fluctua-
tions. If the supply is excessively noisy, connect a 5
resistor between the supply and VDD, as shown in
Figure 12.
MAX199
Multi-Range (±4V, ±2V, +4V, +2V),
+5V Supply, 12-Bit DAS with 8+4 Bus Interface
______________________________________________________________________________________
15
_Ordering Information (continued)
28 Narrow Ceramic SB**
-55°C to +125°C
MAX199BMYI
28 Narrow Ceramic SB**
-55°C to +125°C
MAX199AMYI
28 SSOP
-40°C to +85°C
MAX199BEAI
28 SSOP
-40°C to +85°C
MAX199AEAI
28 Wide SO
-40°C to +85°C
MAX199BEWI
28 Wide SO
28 Narrow Plastic DIP
-40°C to +85°C
MAX199AEWI
MAX199BENI
MAX199AENI
PIN-PACKAGE
TEMP. RANGE
PART
VDD
GND
DGND
AGND
+5V
SUPPLY
R* = 5
DIGITAL
CIRCUITRY
4.7
F
0.1
F
MAX199
**
* OPTIONAL
** CONNECT AGND AND DGND WITH A GROUND PLANE OR A SHORT TRACE
Figure 12. Power-Supply Grounding Connection
TRANSISTOR COUNT: 2956
SUBSTRATE CONNECTED TO GND
___________________Chip Topography
CH5
CH6
CH7
INT
REFADJ
0.231"
(5.870mm)
0.144"
(3.659mm)
D2
CH0
CH1
D0
D1
AGND
CH4
CH3
CH2
VCC
VDD
REF
DGND
CLK
WR
CS
RD
HBEN
SHDN
D7
D6
D5
D4
D3
**
Contact factory for availability and processing to MIL-STD-883.
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