參數(shù)資料
型號: MAX3421EEHJ+
廠商: Maxim Integrated Products
文件頁數(shù): 25/28頁
文件大?。?/td> 0K
描述: IC USB PERIPH/HOST CNTRL 32TQFP
產(chǎn)品培訓(xùn)模塊: Lead (SnPb) Finish for COTS
Obsolescence Mitigation Program
標(biāo)準(zhǔn)包裝: 360
控制器類型: USB 外設(shè)控制器
接口: USB/串行
電源電壓: 3 V ~ 3.6 V
電流 - 電源: 15mA
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 32-TQFP
供應(yīng)商設(shè)備封裝: 32-TQFP(5x5)
包裝: 管件
產(chǎn)品目錄頁面: 1407 (CN2011-ZH PDF)
配用: MAX3421EVKIT-1+-ND - EVAL KIT FOR MAX3421E
MAX3421E
USB Peripheral/Host Controller
with SPI Interface
6
Maxim Integrated
Pin Description (continued)
PIN
NAME
INPUT/
OUTPUT
FUNCTION
21
D+
Input/
Output
USB D+ Signal. Connect D+ to a USB connector through a 33
Ω ±1% series resistor. A
switchable 1.5k
Ω D+ pullup resistor and 15kΩ D+ pulldown resistor is internal to the device.
22
VBCOMP
Input
VBUS Comparator Input. VBCOMP is internally connected to a voltage comparator to allow the
SPI master to detect (through an interrupt or checking a register bit) the presence or loss of
power on VBUS. Bypass VBCOMP to ground with a 1.0F ceramic capacitor. VBCOMP is pulled
down to ground with RIN (see Electrical Characteristics).
23
VCC
Input
USB Transceiver and Logic Core Power-Supply Input. Connect VCC to a positive 3.3V power
supply. Bypass VCC to ground with a 1.0F ceramic capacitor as close to the VCC pin as possible.
24
XI
Input
Crystal Oscillator Input. Connect XI to one side of a parallel resonant 12MHz ±0.25% crystal
and a load capacitor to GND. XI can also be driven by an external clock referenced to VCC.
25
XO
Output
Crystal Oscillator Output. Connect XO to the other side of a parallel resonant 12MHz ±0.25% crystal
and a load capacitor to GND. Leave XO unconnected if XI is driven with an external source.
26
GPIN0
27
GPIN1
28
GPIN2
29
GPIN3
30
GPIN4
31
GPIN5
32
GPIN6
Input
General-Purpose Inputs. GPIN7–GPIN0 are connected to VL with internal pullup resistors.
GPIN7–GPIN0 logic levels are referenced to the voltage on VL.
EP
Input
Exposed Pad, Connected to Ground. Connect EP to GND or leave unconnected. EP is located on
the bottom of the TQFN package. The TQFP package does not have an exposed pad.
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