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參數(shù)資料
| 型號(hào)： | MAX4732EUA+T |
| 廠商： | Maxim Integrated Products |
| 文件頁(yè)數(shù)： | 7/14頁(yè) |
| 文件大?。?/td> | 0K |
| 描述： | IC SWITCH DUAL SPST 8UMAX |
| 產(chǎn)品培訓(xùn)模塊： | Lead (SnPb) Finish for COTS Obsolescence Mitigation Program |
| 標(biāo)準(zhǔn)包裝： | 2,500 |
| 功能： | 開(kāi)關(guān) |
| 電路： | 2 x SPST - NC |
| 導(dǎo)通狀態(tài)電阻： | 50 歐姆 |
| 電壓電源： | 單電源 |
| 電壓 - 電源，單路/雙路(±)： | 2 V ~ 11 V |
| 電流 - 電源： | 1µA |
| 工作溫度： | -40°C ~ 85°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 8-TSSOP，8-MSOP（0.118"，3.00mm 寬） |
| 供應(yīng)商設(shè)備封裝： | 8-uMAX |
| 包裝： | 帶卷 (TR) |
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MAX4731/MAX4732/MAX4733
50
, Dual SPST Analog Switches in UCSP
2
_______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS—Single +3V Supply
(V+ = +3V ±10%, VIH = +2.0V, VIL = +0.8V, TA = TMIN to TMAX, unless otherwise noted. Typical values are at V+ = +3V, TA = +25°C.)
(Notes 3, 4)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
(All voltages referenced to GND.)
V+ ...........................................................................-0.3V to +12V
IN_, COM_, NO_, NC_ (Note 1)....................-0.3V to (V+ + 0.3V)
Continuous Current (any pin) ...........................................±10mA
Peak Current (any pin, pulsed at 1ms, 10% duty cycle) ...±20mA
Continuous Power Dissipation (TA = +70°C)
8-Pin MAX (derate 4.5mW/°C above +70°C) .............362mW
8-Pin TDFN (derate 24.4mW/°C above +70°C) .........1951mW
9-Bump UCSP (derate 4.7mW/°C above +70°C).........379mW
Operating Temperature Range ...........................-40°C to +85°C
Storage Temperature Range .............................-65°C to +150°C
Maximum Junction Temperature .....................................+150°C
Lead Temperature (soldering, 10s) .................................+300°C
Bump Temperature (soldering, Note 2)
Infrared (15s) ...............................................................+220°C
Vapor Phase (60s) .......................................................+215°C
Note 1: Signals on IN_, NO_, NC_, or COM_ exceeding V+ or GND are clamped by internal diodes. Limit forward-diode current to
maximum current rating.
Note 2: This device is constructed using a unique set of packaging techniques that impose a limit on the thermal profile the device
can be exposed to during board level solder attach and rework. This limit permits only the use of the solder profiles recom-
mended in the industry-standard specification, JEDEC 020A, paragraph 7.6, Table 3 for IR/VPR and Convection reflow. Pre-
heating is required. Hand or wave soldering is not allowed.
PARAMETER
SYMBOL
CONDITIONS
TA
MIN
TYP
MAX
UNITS
ANALOG SWITCH
Analog Signal Range
VCOM_,
VNO_, VNC_
0V+
V
+25°C
19
50
On-Resistance
RON
V+ = +2.7V,
ICOM_ = 5mA;
VNO_ or VNC_ = +1.5V
TMIN to
TMAX
60
+25°C
0.8
3.5
On-Resistance Matching
Between Channels (Notes 5, 6)
RON
V+ = +2.7V,
ICOM_ = 5mA;
VNO_ or VNC_ = +1.5V
TMIN to
TMAX
4.5
+25°C
2.3
9
On-Resistance Flatness
(Note 7)
RFLAT(ON)
V+ = +2.7V,
ICOM_ = 5mA;
VNO_ or VNC_ = +1V, +1.5V, +2V
TMIN to
TMAX
11
+25°C
-0.1
+0.1
NO_ or NC_ Off-Leakage Current
(Note 8)
INO_(OFF)
INC_(OFF)
V+ = +3.6V,
VCOM_ = +0.3V, +3V;
VNO_ or VNC_ = +3V, +0.3V
TMIN to
TMAX
-2
+2
nA
+25°C
-0.1
+0.1
COM_ Off-Leakage Current
(Note 8)
ICOM_(OFF)
V+ = +3.6V,
VCOM_ = +0.3V, +3V;
VNO_ or VNC_ = +3V, +0.3V
TMIN to
TMAX
-2
+2
nA
+25°C
-0.2
+0.2
COM_ On-Leakage Current
(Note 8)
ICOM_(ON)
V+ = +3.6V,
VCOM_ = +0.3V, +3.0V;
VNO_ or VNC_ = +0.3V, +3V, or
floating
TMIN to
TMAX
-4
+4
nA
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