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參數(shù)資料
| 型號(hào)： | MAX5891EGK+TD |
| 廠商： | Maxim Integrated Products |
| 文件頁(yè)數(shù)： | 4/16頁(yè) |
| 文件大?。?/td> | 0K |
| 描述： | IC DAC 16BIT LVDS 600MSPS 68-QFN |
| 產(chǎn)品培訓(xùn)模塊： | Lead (SnPb) Finish for COTS Obsolescence Mitigation Program |
| 標(biāo)準(zhǔn)包裝： | 2,500 |
| 設(shè)置時(shí)間： | 11ns |
| 位數(shù)： | 16 |
| 數(shù)據(jù)接口： | 并聯(lián) |
| 轉(zhuǎn)換器數(shù)目： | 1 |
| 電壓電源： | 模擬和數(shù)字 |
| 功率耗散（最大）： | 301mW |
| 工作溫度： | -40°C ~ 85°C |
| 安裝類(lèi)型： | 表面貼裝 |
| 封裝/外殼： | 68-VFQFN 裸露焊盤(pán) |
| 供應(yīng)商設(shè)備封裝： | 68-QFN 裸露焊盤(pán)（10x10） |
| 包裝： | 帶卷 (TR) |
| 輸出數(shù)目和類(lèi)型： | 2 電流，單極 |
| 采樣率（每秒）： | 600M |
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MAX5891
Grounding, Bypassing, and Power-Supply
Considerations
Grounding and power-supply decoupling strongly influ-
ence the MAX5891 performance. Unwanted digital
crosstalk coupling through the input, reference, power
supply, and ground connections affects dynamic per-
formance. High-speed, high-frequency applications
require closely followed proper grounding and power-
supply decoupling. These techniques reduce EMI and
internal crosstalk that can significantly affect the
MAX5891 dynamic performance.
Use a multilayer printed circuit board (PCB) with sepa-
rate ground and power-supply planes. Run high-speed
signals on lines directly above the ground plane. Keep
digital signals as far away from sensitive analog inputs
and outputs, reference input sense lines, common-
mode inputs, and clock inputs as practical. Use a sym-
metric design of clock input and the analog output lines
to minimize 2nd-order harmonic distortion components,
thus optimizing the DAC’s dynamic performance. Keep
digital signal paths short and run lengths matched to
avoid propagation delay and data skew mismatches.
The MAX5891 requires five separate power-supply
inputs for analog (AVDD1.8 and AVDD3.3), digital
(DVDD1.8 and DVDD3.3), and clock (AVCLK) circuitry.
Decouple each AVDD3.3, AVDD1.8, AVCLK, DVDD3.3, and
DVDD1.8 input with a separate 0.1F capacitor as close
to the device as possible with the shortest possible con-
nection to the respective ground plane (Figure 7).
Connect all of the 3.3V supplies together at one point
with ferrite beads to minimize supply noise coupling.
Decouple all five power-supply voltages at the point they
enter the PCB with tantalum or electrolytic capacitors.
Ferrite beads with additional decoupling capacitors
forming a pi network can also improve performance.
Similarly, connect all 1.8V supplies together at one point
with ferrite beads.
The analog and digital power-supply inputs AVDD3.3,
AVCLK, and DVDD3.3 allow a 3.135V to 3.465V supply
voltage range. The analog and digital power-supply
inputs AVDD1.8 and DVDD1.8 allow a 1.71V to 1.89V
supply voltage range.
The MAX5891 is packaged in a 68-pin QFN-EP pack-
age with exposed paddle, providing optimized DAC AC
performance. The exposed pad must be soldered to
the ground plane of the PCB. Thermal efficiency is not
the key factor, since the MAX5891 features low- power
operation. The exposed pad ensures a solid ground
connection between the DAC and the PCB’s ground
layer.
The data converter die attaches to an EP lead frame
with the back of this frame exposed at the package
bottom surface, facing the PCB side of the package.
This allows for a solid attachment of the package to the
PCB with standard infrared (IR) reflow soldering tech-
niques. A specially created land pattern on the PCB,
matching the size of the EP (6mm x 6mm), ensures the
proper attachment and grounding of the DAC. Place
vias into the land area and implement large ground
16-Bit, 600Msps, High-Dynamic-Performance
DAC with LVDS Inputs
12
______________________________________________________________________________________
MAX5891
OUTP
OUTN
AGND
25
Ω
50
Ω
25
Ω
OUTP
OUTN
D0–D15
LVDS
DATA INPUTS
Figure 6. Differential Output Configuration
MAX5891
OUTP
AVDD3.3
AVDD1.8
DVDD3.3
DVDD1.8
AVCLK
OUTN
0.1
μF
3.3V VOLTAGE SUPPLY
0.1
μF
0.1
μF
0.1
μF
1.8V VOLTAGE SUPPLY
0.1
μF
BYPASSING—DAC LEVEL
*FERRITE BEADS
D0–D15
LVDS
DATA INPUTS
*
**
Figure 7. Recommended Power-Supply Decoupling and
Bypassing Circuitry
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| MAX5891EVKIT | 功能描述:數(shù)模轉(zhuǎn)換器- DAC MAX5889/MAX5890/MAX5891 Evaluation Kits RoHS:否 制造商:Texas Instruments 轉(zhuǎn)換器數(shù)量:1 DAC 輸出端數(shù)量:1 轉(zhuǎn)換速率:2 MSPs 分辨率:16 bit 接口類(lèi)型:QSPI, SPI, Serial (3-Wire, Microwire) 穩(wěn)定時(shí)間:1 us 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SOIC-14 封裝:Tube |
| MAX5891EVKIT# | 功能描述:數(shù)模轉(zhuǎn)換器- DAC RoHS:否 制造商:Texas Instruments 轉(zhuǎn)換器數(shù)量:1 DAC 輸出端數(shù)量:1 轉(zhuǎn)換速率:2 MSPs 分辨率:16 bit 接口類(lèi)型:QSPI, SPI, Serial (3-Wire, Microwire) 穩(wěn)定時(shí)間:1 us 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SOIC-14 封裝:Tube |
| MAX5893EGK+D | 功能描述:數(shù)模轉(zhuǎn)換器- DAC 12-Bit 2Ch 500Msps DAC RoHS:否 制造商:Texas Instruments 轉(zhuǎn)換器數(shù)量:1 DAC 輸出端數(shù)量:1 轉(zhuǎn)換速率:2 MSPs 分辨率:16 bit 接口類(lèi)型:QSPI, SPI, Serial (3-Wire, Microwire) 穩(wěn)定時(shí)間:1 us 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SOIC-14 封裝:Tube |
| MAX5893EGK+TD | 功能描述:數(shù)模轉(zhuǎn)換器- DAC 12-Bit 2Ch 500Msps DAC RoHS:否 制造商:Texas Instruments 轉(zhuǎn)換器數(shù)量:1 DAC 輸出端數(shù)量:1 轉(zhuǎn)換速率:2 MSPs 分辨率:16 bit 接口類(lèi)型:QSPI, SPI, Serial (3-Wire, Microwire) 穩(wěn)定時(shí)間:1 us 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SOIC-14 封裝:Tube |
| MAX5893EGK-D | 功能描述:數(shù)模轉(zhuǎn)換器- DAC RoHS:否 制造商:Texas Instruments 轉(zhuǎn)換器數(shù)量:1 DAC 輸出端數(shù)量:1 轉(zhuǎn)換速率:2 MSPs 分辨率:16 bit 接口類(lèi)型:QSPI, SPI, Serial (3-Wire, Microwire) 穩(wěn)定時(shí)間:1 us 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SOIC-14 封裝:Tube |
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