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參數(shù)資料
| 型號： | MAX5891EGK+TD |
| 廠商： | Maxim Integrated Products |
| 文件頁數(shù)： | 9/16頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC DAC 16BIT LVDS 600MSPS 68-QFN |
| 產品培訓模塊： | Lead (SnPb) Finish for COTS Obsolescence Mitigation Program |
| 標準包裝： | 2,500 |
| 設置時間： | 11ns |
| 位數(shù)： | 16 |
| 數(shù)據接口： | 并聯(lián) |
| 轉換器數(shù)目： | 1 |
| 電壓電源： | 模擬和數(shù)字 |
| 功率耗散（最大）： | 301mW |
| 工作溫度： | -40°C ~ 85°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 68-VFQFN 裸露焊盤 |
| 供應商設備封裝： | 68-QFN 裸露焊盤（10x10） |
| 包裝： | 帶卷 (TR) |
| 輸出數(shù)目和類型： | 2 電流，單極 |
| 采樣率（每秒）： | 600M |
MAX5891
16-Bit, 600Msps, High-Dynamic-Performance
DAC with LVDS Inputs
2
_______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
(AVDD3.3 = DVDD3.3 = AVCLK = 3.3V, AVDD1.8 = DVDD1.8 = 1.8V, external reference VREFIO = 1.2V, output load 50
Ω double-terminated,
transformer-coupled output, IOUT = 20mA, TA = -40°C to +85°C, unless otherwise noted. Specifications at TA
≥ +25°C are guaranteed
by production testing. Specifications at TA < +25°C are guaranteed by design and characterization. Typical values are at TA = +25°C.)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
AVDD1.8, DVDD1.8 to AGND, DGND, DACREF,
and CGND.......................................................-0.3V to +2.16V
AVDD3.3, DVDD3.3, AVCLK to AGND, DGND,
DACREF, and CGND.........................................-0.3V to +3.9V
REFIO, FSADJ to AGND, DACREF,
DGND, and CGND ..........................-0.3V to (AVDD3.3 + 0.3V)
OUTP, OUTN to AGND, DGND, DACREF,
and CGND .......................................-1.2V to (AVDD3.3 + 0.3V)
CLKP, CLKN to AGND, DGND, DACREF,
and CGND..........................................-0.3V to (AVCLK + 0.3V)
PD to AGND, DGND, DACREF,
and CGND.......................................-0.3V to (DVDD3.3 + 0.3V)
Digital Data Inputs (D0N–D15N, D0P–D15P) to AGND,
DGND, DACREF, and CGND ..........-0.3V to (DVDD1.8 + 0.3V)
Continuous Power Dissipation (TA = +70°C) (Note 1)
68-Pin QFN-EP (derate 28.6mW/°C above +70°C)....3333mW
Thermal Resistance
θJA (Note 1) ....................................24°C/W
Operating Temperature Range ..........................-40°C to +85°C
Junction Temperature .....................................................+150°C
Storage Temperature Range ............................-60°C to +150°C
Lead Temperature (soldering, 10s) ................................+300°C
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
STATIC PERFORMANCE
Resolution
16
Bits
Integral Nonlinearity
INL
Measured differentially
±3.8
LSB
Differential Nonlinearity
DNL
Measured differentially
±2.8
LSB
Offset Error
OS
-0.02
±0.001
+0.02
%FS
Full-Scale Gain Error
GEFS
External reference
-4
±1
+4
%FS
Internal reference
±130
Gain-Drift Tempco
External reference
±100
ppm/
°C
Full-Scale Output Current
IOUT
220
mA
Output Compliance
Single-ended
-1.0
+1.1
V
Output Resistance
ROUT
1M
Ω
Output Capacitance
COUT
5pF
Output Leakage Current
PD = high, power-down mode
±1A
DYNAMIC PERFORMANCE
Maximum DAC Update Rate
600
Msps
Minimum DAC Update Rate
1
Msps
fOUT = 36MHz
AFULL-SCALE = -3.5dBm
-163
Noise Spectral Density
N
fCLK = 500MHz,
-12dBFS, 20MHz
offset from the
carrier
fOUT = 151MHz
AFULL-SCALE = -6.4dBm
-155
dBFS/Hz
Note 1: Thermal resistance based on a multilayer board with 4x4 via array in exposed paddle area
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