參數(shù)資料
型號: MAX7317ATE+T
廠商: Maxim Integrated Products
文件頁數(shù): 4/12頁
文件大?。?/td> 0K
描述: IC I/O EXPANDER SPI 10B 16TQFN
產(chǎn)品培訓(xùn)模塊: Lead (SnPb) Finish for COTS
Obsolescence Mitigation Program
標(biāo)準(zhǔn)包裝: 2,500
接口: SPI/Microwire
輸入/輸出數(shù): 10
中斷輸出:
電源電壓: 2.25 V ~ 3.6 V
工作溫度: -40°C ~ 125°C
安裝類型: 表面貼裝
封裝/外殼: 16-WFQFN 裸露焊盤
供應(yīng)商設(shè)備封裝: 16-TQFN-EP(3x3)
包裝: 帶卷 (TR)
10-Port SPI-Interfaced I/O Expander with
Overvoltage and Hot-Insertion Protection
Package Information (continued)
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information
go to www.maxim-ic.com/packages.)
12x16L
QFN
THIN.EPS
0.10 C
0.08 C
0.10 M C A B
D
D/2
E/2
E
A1
A2
A
E2
E2/2
L
k
e
(ND - 1) X e
(NE - 1) X e
D2
D2/2
b
L
e
L
C
L
e
CL
L
C
L
C
E
1
2
21-0136
PACKAGE OUTLINE
12, 16L, THIN QFN, 3x3x0.8mm
1. DIMENSIONING & TOLERANCING CONFORM TO ASME Y14.5M-1994.
EXPOSED PAD VARIATIONS
1.10
T1633-1
0.95
CODES
PKG.
T1233-1
MIN.
0.95
NOM.
1.10
D2
1.25
1.10
0.95
1.25
NOM.
1.10
MAX.
1.25
MIN.
0.95
MAX.
1.25
E2
12
N
k
A2
0.25
NE
A1
ND
0
0.20 REF
-
3
0.02
3
0.05
L
e
E
0.45
2.90
b
D
A
0.20
2.90
0.70
0.50 BSC.
0.55
3.00
0.65
3.10
0.25
3.00
0.75
0.30
3.10
0.80
16
0.20 REF
0.25
-
0
4
0.02
4
-
0.05
0.50 BSC.
0.30
2.90
0.40
3.00
0.20
2.90
0.70
0.25
3.00
0.75
3.10
0.50
0.80
3.10
0.30
PKG
REF. MIN.
12L 3x3
NOM.
MAX.
NOM.
16L 3x3
MIN.
MAX.
0.35 x 45∞
PIN ID
JEDEC
WEED-1
0.35 x 45∞
WEED-2
2. ALL DIMENSIONS ARE IN MILLIMETERS. ANGLES ARE IN DEGREES.
3. N IS THE TOTAL NUMBER OF TERMINALS.
4. THE TERMINAL #1 IDENTIFIER AND TERMINAL NUMBERING CONVENTION SHALL CONFORM TO
JESD 95-1 SPP-012. DETAILS OF TERMINAL #1 IDENTIFIER ARE OPTIONAL, BUT MUST BE LOCATED
WITHIN THE ZONE INDICATED. THE TERMINAL #1 IDENTIFIER MAY BE EITHER A MOLD OR
MARKED FEATURE.
5. DIMENSION b APPLIES TO METALLIZED TERMINAL AND IS MEASURED BETWEEN 0.20 mm AND 0.25 mm
FROM TERMINAL TIP.
6. ND AND NE REFER TO THE NUMBER OF TERMINALS ON EACH D AND E SIDE RESPECTIVELY.
7. DEPOPULATION IS POSSIBLE IN A SYMMETRICAL FASHION.
8. COPLANARITY APPLIES TO THE EXPOSED HEAT SINK SLUG AS WELL AS THE TERMINALS.
9. DRAWING CONFORMS TO JEDEC MO220 REVISION C.
NOTES:
E
2
21-0136
PACKAGE OUTLINE
12, 16L, THIN QFN, 3x3x0.8mm
T1233-3
1.10
1.25
0.95
1.10
0.35 x 45∞
1.25
WEED-1
0.95
T1633F-3
0.65
T1633-4
0.95
0.80
0.95
0.65
0.80
1.10
1.25
0.95
1.10
0.225 x 45∞
0.95
WEED-2
0.35 x 45∞
1.25
WEED-2
T1633-2
0.95
1.10
1.25
0.95
1.10
0.35 x 45∞
1.25
WEED-2
NO
DOWN
BONDS
ALLOWED
YES
NO
YES
N/A
NO
MAX7317
12
Maxim Integrated 160 Rio Robles, San Jose, CA 95134 USA 1-408-601-1000
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied.
Maxim reserves the right to change the circuitry and specifications without notice at any time. The parametric values (min and max limits) shown in the Electrical
Characteristics table are guaranteed. Other parametric values quoted in this data sheet are provided for guidance.
2005 Maxim Integrated
The Maxim logo and Maxim Integrated are trademarks of Maxim Integrated Products, Inc.
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