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參數(shù)資料
| 型號： | MAX8893BEWV+ |
| 廠商： | MAXIM INTEGRATED PRODUCTS INC |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | SPECIALTY MICROPROCESSOR CIRCUIT, PBGA30 |
| 封裝： | 3 X 2.50 MM, 0.64 MM HEIGHT, ROHS COMPLIANT, WLP-30 |
| 文件頁數(shù)： | 12/51頁 |
| 文件大?。?/td> | 4976K |
| 代理商： | MAX8893BEWV+ |
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PMICs for Multimedia Application Processors
in a 3.0mm x 2.5mm WLP
MAX8893A/MAX8893B/MAX8893C
2 ______________________________________________________________________________________
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
IN1, IN2, BATT, COM1, COM2 to AGND.............-0.3V to +6.0V
BUCK, LS, ENLS, ENBUCK, ENLDO1, ENLDO2,
ENLDO3, ENLDO45, REFBP, LDO2, LDO3,
SCL, SDA, ENUSB, CB, NC1, NC2,
NO1, NO2 to AGND .......................... -0.3V to (VBATT + 0.3V)
LDO1, LDO4, LDO5 to AGND.................. -0.3V to (VIN2 + 0.3V)
PGND to AGND....................................................-0.3V to +0.3V
LX Current .....................................................................1.5ARMS
LX to AGND (Note 1)................................ -0.3V to (VIN1 + 0.3V)
Continuous Power Dissipation (TA = +70NC)
30-Bump, 3.0mm x 2.5mm WLP (derate 20.0mW/NC
above +70NC).............................................................1600mW
Junction-to-Ambient Thermal Resistance (θJA)
(Note 2) ........................................................................50NC/W
Operating Temperature Range.......................... -40NC to +85NC
Junction Temperature .....................................................+150NC
Storage Temperature Range............................ -65NC to +150NC
Bump Temperature (soldering)
Infrared (15s)...............................................................+200NC
Vapor Phase (20s).......................................................+215NC
ELECTRICAL CHARACTERISTICS
(Typical Operating Circuit, VIN = 3.7V, CBATT = CIN1 = CIN2 = 2.2FF, CREFBP = 0.1FF, TA = -40NC to +85NC, unless otherwise noted.
Typical values are at TA = +25NC.) (Notes 3, 4)
ABSOLUTE MAXIMUM RATINGS
Note 1: LX has internal clap diodes to PGND and IN1. Applications that forward bias these diodes should take care not to exceed
the IC’s package-dissipation limits.
Note 2: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNIT
Input Supply Range
2.7
5.5
V
Shutdown Supply Current
VCB = 0V or VIN, VENUSB = VIN, VENLS = VENBUCK =
VENLDO1 = VENLDO2 = VENLDO3 = VENLDO45 = 0V
0.6
5
F
A
No-Load Supply Current
No load on BUCK, LDO1, LDO2, LDO3, LDO4, and
LDO5, VENUSB = 0V, VENLS = VIN
160
200
F
A
Light-Load Supply Current
BUCK on with 500FA load, all LDOs on with no load,
VENUSB = 0V, VENLS = VIN
315
F
A
UNDERVOLTAGE LOCKOUT
Undervoltage Lockout (Note 5)
VIN_ rising
2.70
2.85
3.05
V
VIN_ falling
2.35
2.55
THERMAL SHUTDOWN
Thermal Shutdown Threshold
TA rising
160
N
C
Thermal Shutdown Hysteresis
10
N
C
REFERENCE
Reference Bypass Output
Voltage
0.786
0.800
0.814
V
REF Supply Rejection
2.7V P VIN P 5.5V
0.2
mV/V
LOGIC AND CONTROL INPUTS
Input Low Level
ENLS, ENBUCK, ENLDO1, ENLDO2, ENLDO3,
ENLDO45, ENUSB, SDA, SCL, 2.7V P VIN P 5.5V
0.4
V
Input High Level
ENLS, ENBUCK, ENLDO1, ENLDO2, ENLDO3,
ENLDO45, ENUSB, SDA, SCL, 2.7V P VIN P 5.5V
1.4
V
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