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參數(shù)資料
型號(hào): MAX9650ATA+T
廠商: Maxim Integrated Products
文件頁(yè)數(shù): 6/13頁(yè)
文件大?。?/td> 0K
描述: IC OPAMP VCOM DRIVE 8-TDFN
產(chǎn)品培訓(xùn)模塊: Lead (SnPb) Finish for COTS
Obsolescence Mitigation Program
標(biāo)準(zhǔn)包裝: 2,500
應(yīng)用: TFT-LCD 面板:VCOM 驅(qū)動(dòng)器
輸出類型: 滿擺幅
電路數(shù): 1
-3db帶寬: 35MHz
轉(zhuǎn)換速率: 40 V/µs
電流 - 電源: 3.7mA
電流 - 輸出 / 通道: 1.3A
電壓 - 電源,單路/雙路(±): 9 V ~ 20 V,±4.5 V ~ 10 V
安裝類型: 表面貼裝
封裝/外殼: 8-WDFN 裸露焊盤
供應(yīng)商設(shè)備封裝: 8-TDFN-EP(3x3)
包裝: 帶卷 (TR)
High-Current VCOM Drive Op Amps
for TFT LCDs
2
Maxim Integrated
MAX9650/MAX9651
ABSOLUTE MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
(VDD = 19V, VGND = 0V, VCM = VOUT = VDD/2, TA = TMIN to TMAX, unless otherwise noted. Typical values are at TA = +25°C.) (Note 1)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
Supply Voltage (VDD to GND) ................................-0.3V to +22V
Any Other Pin to GND ................................-0.3V to (VDD + 0.3V)
IN_+/IN_- (current)............................................................±20mA
OUT_ (current) ......................................................................1.3A
Continuous Power Dissipation (TA = +70°C)
SOT23 (derate 3.7mW/°C above +70°C) .................297.4mW
MAX-EP (derate 12.9mW/°C
above +70°C).......................................................1030.9mW
TDFN-EP (derate 23.8mW/°C
above +70°C).......................................................1951.2mW
Operating Temperature Range .........................-40°C to +125°C
Junction Temperature ......................................................+150°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Soldering Temperature (reflow) .......................................+260°C
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
Supply Voltage Range
VDD
Guaranteed by PSRR
6
20
V
Quiescent Current
IDD
Per channel
3.7
8
mA
High Output Voltage
VOH
IH = +5mA, VIN = VDD
VDD -
0.30
VDD -
0.05
V
Low Output Voltage
VOL
IL = -5mA, VIN = 0V
0.05
0.30
V
TA = +25°C
-14
3.5
+14
Input Offset Voltage
VOS
TA = -40°C to +125°C
-17
+17
mV
IOUT = 0mA to -80mA
+0.2
Load Regulation
LR
IOUT = 0mA to +80mA
-0.2
mV/mA
Input Bias Current
IFB
At VIN = 9.5V
0.01
1A
Voltage Gain
AV
RL = 10k
Ω, CL = 50pF
0.99
1.01
V/V
Power-Supply Rejection Ratio
PSRR
VDD = 6V to 20V, VCM = VOUT = 3V
70
95
dB
Common-Mode Input Voltage
Range
CMVR
Inferred from CMRR test
0.5
VDD -
0.5
V
Common-Mode Rejection Ratio
CMRR
0.5V
≤ VCM ≤ VDD - 0.5V
60
80
dB
MAX9650AZK+
20
VOUT = 9.5V
(Note 2)
MAX9650AUA+
80
Continuous Output Current
IO
VDD = 15V, VOUT = 7.5V
MAX9650ATA+
±350
mA
Transient Peak Output Current
IPK
(Note 3)
±1.3
A
Bandwidth
BW
-3dB
35
MHz
Slew Rate
SR
4V step, CL = 50pF, RL = 10k
Ω, AV = +1V/V
40
V/s
Settling Time
tS
Settling to 0.1% of VOUT, IL = 0 to 1000mA,
RS = 2.2
Ω, CS = 0.1F (Figure 1)
2.0
s
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