參數(shù)資料
型號: MAX98089EVKIT#WLP
廠商: Maxim Integrated Products
文件頁數(shù): 31/131頁
文件大?。?/td> 0K
描述: KIT EVAL FOR MAX98089-WLP
產品培訓模塊: Lead (SnPb) Finish for COTS
Obsolescence Mitigation Program
標準包裝: 1
系列: DirectDrive®
主要目的: 音頻編解碼器
嵌入式: 是,DSP
已用 IC / 零件: MAX98089
主要屬性: 2.8 V ~ 5.5 V 輸入電壓
已供物品: 板,線纜,軟件
Low-Power, Stereo Audio Codec
with FlexSound Technology
Recommended PCB Routing
The MAX98089EWY uses a 63-bump WLP package.
Figure 43 provides an example of how to connect to all
active bumps using 3 layers of the PCB. To ensure unin-
terrupted ground returns, use layer 2 as a connecting
layer between layer 1 and layer 3 and flood the remaining
area with ground.
Supply Bypassing, Layout, and Grounding
Proper layout and grounding are essential for optimum
performance. When designing a PCB for the ICs, parti-
tion the circuitry so that the analog sections of the IC are
separated from the digital sections. This ensures that the
analog audio traces are not routed near digital traces.
Use a large continuous ground plane on a dedicated
layer of the PCB to minimize loop areas. Connect AGND,
DGND, HPGND, SPKLGND, and SPKRGND directly to
the ground plane using the shortest trace length possible.
Proper grounding improves audio performance, minimizes
crosstalk between channels, and prevents any digital
noise from coupling into the analog audio signals.
Ground the bypass capacitors on MICBIAS, REG, and
REF directly to the ground plane with minimum trace
length. Also be sure to minimize the path length to
AGND. Bypass AVDD directly to AGND.
Connect all digital I/O termination to the ground plane
with minimum path length to DGND. Bypass DVDD,
DVDDS1, and DVDDS2 directly to DGND.
Place the capacitor between C1P and C1N as close as
possible to the ICs to minimize trace length from C1P to
C1N. Inductance and resistance added between C1P and
C1N reduce the output power of the headphone ampli-
fier. Bypass HPVDD and HPVSS with a capacitor located
close to HPVSS with a short trace length to HPGND. Close
decoupling of HPVSS minimizes supply ripple and maxi-
mizes output power from the headphone amplifier.
HPSNS senses ground noise on the headphone jack and
adds the same noise to the output audio signal, thereby
making the output (headphone output minus ground)
noise free. Connect HPSNS to the headphone jack shield
to ensure accurate pickup of headphone ground noise.
Bypass SPKLVDD and SPKRVDD to SPKLGND and
SPKRGND, respectively, with as little trace length as
possible. Connect SPKLP, SPKLN, SPKRP, and SPKRN
to the stereo speakers using the shortest traces pos-
sible. Reducing trace length minimizes radiated EMI.
Route SPKLP/SPKLN and SPKRP/SPKRN as differential
pairs on the PCB to minimize loop area, thereby the
inductance of the circuit. If filter components are used
on the speaker outputs, be sure to locate them as close
as possible to the IC to ensure maximum effectiveness.
Minimize the trace length from any ground-connected
passive components to SPKLGND and SPKRGND to
further minimize radiated EMI.
Figure 43. Suggested Routing for the MAX98089EWY
LAYER 1
LAYER 2
LAYER 3
Maxim Integrated
126
MAX98089
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相關代理商/技術參數(shù)
參數(shù)描述
MAX98089EWY+ 制造商:Maxim Integrated Products 功能描述:STEREO AUDIO CODEC WITH FLEXSOUND TUNING TECHNOLOGY AND BASI - Rail/Tube
MAX98089EWY+T 功能描述:接口—CODEC Audio Codec RoHS:否 制造商:Texas Instruments 類型: 分辨率: 轉換速率:48 kSPs 接口類型:I2C ADC 數(shù)量:2 DAC 數(shù)量:4 工作電源電壓:1.8 V, 2.1 V, 2.3 V to 5.5 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:DSBGA-81 封裝:Reel
MAX98090AETL+ 功能描述:接口—CODEC 5V 130mW Stereo Headphone Amp RoHS:否 制造商:Texas Instruments 類型: 分辨率: 轉換速率:48 kSPs 接口類型:I2C ADC 數(shù)量:2 DAC 數(shù)量:4 工作電源電壓:1.8 V, 2.1 V, 2.3 V to 5.5 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:DSBGA-81 封裝:Reel
MAX98090AETL+T 功能描述:接口—CODEC 5V 130mW Stereo Headphone Amp RoHS:否 制造商:Texas Instruments 類型: 分辨率: 轉換速率:48 kSPs 接口類型:I2C ADC 數(shù)量:2 DAC 數(shù)量:4 工作電源電壓:1.8 V, 2.1 V, 2.3 V to 5.5 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:DSBGA-81 封裝:Reel
MAX98090AEWJ+ 制造商:Maxim Integrated Products 功能描述:- Rail/Tube