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Maxim Integrated Products 3
MAX98307/MAX98308
3.3W Mono Class DG Multilevel Audio Amplifier
PVDD to GND..........................................................-0.3V to +6V
PGND to GND ..................................................... -0.3V to +0.3V
C1N to GND .......................................... (VPVSS - 0.3V) to +0.3V
IN+, IN- (MAX98307)................................ -0.3V to (VCC + 0.3V)
VCC to PVDD (MAX98307).................................. -0.3V to +0.3V
PVSS to SVSS (MAX97307)..................................-0.3V to +0.3V
PVSS, SVSS to GND (MAX98307)...........................-6V to +0.3V
IN+, IN- (MAX98308)...............................................-0.3V to +6V
PVSS to GND (MAX98308) .....................................-6V to +0.3V
All Other Pins to GND ...........................-0.3V to (VPVDD + 0.3V)
Continuous Current Into/Out of PVDD, VCC, PGND, GND,
OUT+, OUT-, C1P, C1N, PVSS, SVSS ...................... Q800mA
Continuous Current (all other pins)................................. Q20mA
Duration of OUT+/OUT- Short Circuit to PGND
or PVDD .................................................................Continuous
Short-Circuit Duration Between
OUT+ and OUT- Pins ............................................Continuous
Continuous Power Dissipation (TA = +70NC) for Multilayer Board
TQFN (derate 20.8mW/NC above +70NC)..................1667mW
WLP (derate 13.7mW/NC above +70NC)....................1100mW
Junction Temperature .....................................................+150NC
Operating Temperature Range.......................... -40NC to +85NC
Storage Temperature Range............................ -65NC to +150NC
Lead Temperature (soldering, 10s) (TQFN-EP)............ +300NC
Soldering Temperature (reflow) ......................................+260NC
ABSOLUTE MAXIMUM RATINGS
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional opera-
tion of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
VPVDD = VCC = VSHDN = 3.6V, VPGND = VGND = 0V, ZL = 8I + 68FH between OUT+ and OUT-, (MAX98307 RIN+ = RIN- = 10kI,
RFB+ = RFB- = 20kI), CIN+ = CIN- = 0.33FF, AV = 14.5dB, AC measurement bandwidth 20Hz to 20kHz, TA = TMIN to TMAX, unless
otherwise noted. Typical values are at TA = +25NC.) (Notes 2, 3)
TQFN
Junction-to-Ambient Thermal Resistance (BJA) ..........48NC/W
Junction-to-Case Thermal Resistance (BJC
WLP
Junction-to-Ambient Thermal Resistance (BJA) ..........73NC/W
Junction-to-Case Thermal Resistance (BJC) ...............30NC/W
PACKAGE THERMAL CHARACTERISTICS (Note 1)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
Power-Supply Range
VPVDD, VCC
Guaranteed by PSRR test
2.6
5.25
V
Quiescent Current
IDD
VPVDD = 3.6V
1.85
2.7
mA
Shutdown Current
ISHDN
SHDN = GND
0.225
10
A
Power-Supply Rejection Ratio
(Note 4)
PSRR
VPVDD = 2.6V to 5.25V
78
dB
f = 217Hz, 200mVP-P ripple
78
f = 10kHz, 200mVP-P ripple
67
Turn-On Time
tON
Time from
shutdown or
power-on to full
operation
MAX98308
25
40
ms
MAX98307,
RIN = 10kI
50
80
Input DC Bias Voltage
VBIAS
1.3
V
Input Resistance (MAX98308)
RIN
AV = 20.5dB (maximum gain)
15
22
kI
AV = 17.5dB
22
AV = 14.5dB
22
AV = 11.5dB
28
AV = 8.5dB
40