參數(shù)資料
型號(hào): MB95F572HPF-G-JNE2
廠(chǎng)商: FUJITSU LTD
元件分類(lèi): 微控制器/微處理器
英文描述: MICROCONTROLLER, PDSO8
封裝: 5.30 X 5.24 MM, 2.10 MM HEIGHT, 1.27 MM PITCH, PLASTIC, M08, SOP-8
文件頁(yè)數(shù): 77/84頁(yè)
文件大?。?/td> 3929K
代理商: MB95F572HPF-G-JNE2
MB95560H/570H/580H Series
DS702-00010-1v0-E
79
Please check the latest package dimension at the following URL.
http://edevice.fujitsu.com/package/en-search/
(Continued)
20-pin plastic TSSOP
Lead pitch
0.65 mm
Package width
×
package length
4.40 mm
× 6.50 mm
Lead shape
Gullwing
Sealing method
Plastic mold
Mounting height
1.20 mm MAX
Weight
0.08 g
20-pin plastic TSSOP
(FPT-20P-M10)
C
2009-2010 FUJITSU SEMICONDUCTOR LIMITED F20031S-c-1-2
#6.50±0.10(.256±.004)
#4.40±0.10
6.40±0.20
(.252±.008)
(.173±.004)
0.10(.004)
0.65(.026)
0.24±0.04
(.009±.002)
1
10
20
11
"A"
Details of "A" part
0~8°
(.024±.006)
0.60±0.15
MAX
1.20(.047)
(Mounting height)
0.10±0.05
(Stand off)
LEAD No.
INDEX
BTM E-MARK
(.004±.002)
0.14
+0.05
–0.04
+.002
–.002
.006
Dimensions in mm (inches).
Note: The values in parentheses are reference values.
Note 1) Pins width and pins thickness include plating thickness.
Note 2) Pins width do not include tie bar cutting remainder.
Note 3) # : These dimensions do not include resin protrusion.
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