參數(shù)資料
型號: MB96F338YSAPMC-GSE2
元件分類: 微控制器/微處理器
英文描述: 16-BIT, FLASH, 48 MHz, MICROCONTROLLER, PQFP144
封裝: 20 X 20 MM, 1.70 MM HEIGHT, 0.50 MM PITCH, PLASTIC, LFQFP-144
文件頁數(shù): 31/134頁
文件大?。?/td> 3710K
代理商: MB96F338YSAPMC-GSE2
MB96330 Series
126
FME-MB96330 rev 4
■ PACKAGE DIMENSION MB96(F)33x LQFP 144P
Please check the latest package dimension at the following URL.
http://edevice.fujitsu.com/package/en-search/
144-pin plastic LQFP
Lead pitch
0.50 mm
Package width
×
package length
20.0
× 20.0 mm
Lead shape
Gullwing
Sealing method
Plastic mold
Mounting height
1.70 mm MAX
Weight
1.20g
Code
(Reference)
P-LFQFP144-20
×20-0.50
144-pin plastic LQFP
(FPT-144P-M08)
C
2003 FUJITSU LIMITED F144019S-c-4-6
Details of "A" part
0.25(.010)
(Stand off)
(.004±.004)
0.10±0.10
(.024±.006)
0.60±0.15
(.020±.008)
0.50±0.20
1.50
+0.20
–0.10
+.008
–.004
.059
0~8
0.50(.020)
"A"
0.08(.003)
0.145±0.055
(.006±.002)
LEAD No. 1
36
INDEX
37
72
73
108
109
144
0.22±0.05
(.009±.002)
M
0.08(.003)
20.00±0.10(.787±.004)SQ
22.00±0.20(.866±.008)SQ
(Mounting height)
*
Dimensions in mm (inches).
Note: The values in parentheses are reference values.
2003-2008 FUJITSU MICROELECTRONICS LIMITED F144019S-c-4-7
Note 1) *:Values do not include resin protrusion.
Resin protrusion is +0.25(.010)Max(each side).
Note 2) Pins width and pins thickness include plating thickness.
Note 3) Pins width do not include tie bar cutting remainder.
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