參數(shù)資料
型號(hào)： MC10319P
廠商： MOTOROLA INC
元件分類： ADC
英文描述： Hex Buffers/Drivers With Open-Collector High-Voltage Outputs 14-CDIP -55 to 125
中文描述： 8-BIT FLASH METHOD ADC, PARALLEL ACCESS, PDIP24
封裝： PLASTIC, DIP-24
文件頁(yè)數(shù)： 19/20頁(yè)
文件大小： 338K
代理商： MC10319P
MC10319
19
MOTOROLA ANALOG IC DEVICE DATA
OUTLINE DIMENSIONS
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION.
ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.13
(0.005) TOTAL IN EXCESS OF D DIMENSION
AT MAXIMUM MATERIAL CONDITION.
J
K
F
1
15
14
28
–A–
–B–
28X
14X
D
P
0.010 (0.25)
S
A
M
0.010 (0.25)
B
S
T
M
B
M
26X
G
–T–
SEATING
PLANE
C
X 45
R
M
DIM
A
B
C
D
F
G
J
K
M
P
R
MIN
17.80
7.40
2.35
0.35
0.41
MAX
18.05
7.60
2.65
0.49
0.90
MIN
0.701
0.292
0.093
0.014
0.016
0.050 BSC
0.009
0.005
0
0.395
0.010
MAX
0.711
0.299
0.104
0.019
0.035
INCHES
MILLIMETERS
1.27 BSC
0.23
0.13
0
10.01
0.25
0.32
0.29
8
10.55
0.75
0.013
0.011
8
0.415
0.029
NOTES:
1. POSITIONAL TOLERANCE OF LEADS (D),
SHALL BE WITHIN 0.25 (0.010) AT MAXIMUM
MATERIAL CONDITION, IN RELATION TO
SEATING PLANE AND EACH OTHER.
2. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
3. DIMENSION B DOES NOT INCLUDE MOLD
FLASH.
DIM
A
B
C
D
F
G
H
J
K
L
M
N
MIN
31.37
13.72
3.94
0.36
1.02
MAX
32.13
14.22
5.08
0.56
1.52
MIN
1.235
0.540
0.155
0.014
0.040
0.100 BSC
0.065
0.008
0.115
0.600 BSC
0
0.020
MAX
1.265
0.560
0.200
0.022
0.060
INCHES
MILLIMETERS
2.54 BSC
1.65
0.20
2.92
15.24 BSC
0
0.51
2.03
0.38
3.43
0.080
0.015
0.135
15
1.02
15
0.040
1
12
13
24
B
H
A
F
D
G
K
SEATING
PLANE
N
C
M
J
L
P SUFFIX
PLASTIC PACKAGE
CASE 709–02
ISSUE C
DW SUFFIX
PLASTIC PACKAGE
CASE 751F–04
(SO–28L)
ISSUE E
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