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參數(shù)資料
| 型號(hào)： | MC33389ADW |
| 廠商： | MOTOROLA INC |
| 元件分類： | 網(wǎng)絡(luò)接口 |
| 英文描述： | System Basis Chip with Low Speed Fault Tolerant CAN |
| 中文描述： | DATACOM, INTERFACE CIRCUIT, PDSO28 |
| 封裝： | PLASTIC, SO-28 |
| 文件頁數(shù)： | 10/35頁 |
| 文件大小： | 609K |
| 代理商： | MC33389ADW |
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MC33389
10
MC33389
Thermal Management
The MC33389 is proposed in two different packages.
HSOP20 for high power applications and SO28WB with 8 pins
to the leadframe for medium power applications.
HSOP20 Package
For such a package, the heat flow is mainly vertical and
each heat source (dissipating element) can be seen as an
independent thermal resistance to the Heatsink. The thermal
network can be roughly depicted as:
Figure 2. HSOP20 Simplified Thermal Model
Example
Assuming I
V1
=100mA at V
bat
=16V,
I
V2
=150mA at V
bat
=16V (Excluding CAN consumption).
I
CAN
=50mA at V
bat
=16V, we have :
P
V1
=1.1W, P
V2
=1.65W, P
can
=0.55W
System assumptions:
If T
amb
=85°C and R
thc/a
=18°C/W, this gives:
T
case
=T
amb
+R
th c/a
x 3.3W = 85+18 x 3.3=145°C
and T
j
V1=T
j
V2=T
jcan
=155°C.
This example represents the limit for the maximum power
dissipations with a HSOP20.
T
ambient
T
case
(heatsink)
V1 power
V2 power
Can power
T
j
(max 155°C)
R
thj/c
=18°C/W
6.5°C/W
9°C/W
R
thc/a
(ECU supplier dependent)
SO28WB Package
The case(pin) to junction R
th
is here represented by only
one thermal resistance for the total power since the 3 power
sources strongly interact on the silicon for such a package.
Figure 3. SO28WB Simplified Thermal Model
Example
Assuming I
V1
=45mA at V
bat
=16V,
I
V2
=45mA at V
bat
=16V (Excluding CAN consumption).
I
CAN
=50mA at V
bat
=16V, we have :
P
V1
=0.5W, P
V2
=0.5W, P
can
=0.55W thus P
total
=1.55W
System assumptions:
If T
amb
=85°C and R
thc/a
=25°C/W, this gives:
T
case
=T
amb
+R
thc/a
x 1.55W=85+25x1.55 =124°C
and T
j
V1=124 + 20 x 1.55= 155°C.
This example represents the limit for the maximum power
dissipations with a SO28WB.
T
case
(pin)
T
j
(max 155°C)
Total power
R
thc/a
T
ambient
R
thj/c
=20°C/W
F
Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com
n
.
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| MC33389CDH | 功能描述:IC SYSTEM BASIS W/CAN 20-HSOP RoHS:是 類別:集成電路 (IC) >> 接口 - 控制器 系列:- 標(biāo)準(zhǔn)包裝:4,900 系列:- 控制器類型:USB 2.0 控制器 接口:串行 電源電壓:3 V ~ 3.6 V 電流 - 電源:135mA 工作溫度:0°C ~ 70°C 安裝類型:表面貼裝 封裝/外殼:36-VFQFN 裸露焊盤 供應(yīng)商設(shè)備封裝:36-QFN（6x6） 包裝:* 其它名稱:Q6396337A |
| MC33389CDHR2 | 功能描述:IC SYSTEM BASE W/CAN 20-HSOP RoHS:是 類別:集成電路 (IC) >> 接口 - 控制器 系列:- 標(biāo)準(zhǔn)包裝:4,900 系列:- 控制器類型:USB 2.0 控制器 接口:串行 電源電壓:3 V ~ 3.6 V 電流 - 電源:135mA 工作溫度:0°C ~ 70°C 安裝類型:表面貼裝 封裝/外殼:36-VFQFN 裸露焊盤 供應(yīng)商設(shè)備封裝:36-QFN（6x6） 包裝:* 其它名稱:Q6396337A |
| MC33389CDW | 功能描述:網(wǎng)絡(luò)控制器與處理器 IC SYSTEM BASIC CHIPS RoHS:否 制造商:Micrel 產(chǎn)品:Controller Area Network (CAN) 收發(fā)器數(shù)量: 數(shù)據(jù)速率: 電源電流（最大值）:595 mA 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:PBGA-400 封裝:Tray |
| MC33389CDWR2 | 功能描述:網(wǎng)絡(luò)控制器與處理器 IC SYSTEM BASIC CHIPS RoHS:否 制造商:Micrel 產(chǎn)品:Controller Area Network (CAN) 收發(fā)器數(shù)量: 數(shù)據(jù)速率: 電源電流（最大值）:595 mA 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:PBGA-400 封裝:Tray |
| MC33389DDW | 功能描述:網(wǎng)絡(luò)控制器與處理器 IC SBC SOW28 RoHS:否 制造商:Micrel 產(chǎn)品:Controller Area Network (CAN) 收發(fā)器數(shù)量: 數(shù)據(jù)速率: 電源電流（最大值）:595 mA 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:PBGA-400 封裝:Tray |
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