參數(shù)資料
型號(hào): MC33389CDW
廠商: MOTOROLA INC
元件分類: 網(wǎng)絡(luò)接口
英文描述: System Basis Chip with Low Speed Fault Tolerant CAN
中文描述: DATACOM, INTERFACE CIRCUIT, PDSO28
封裝: PLASTIC, SO-28
文件頁數(shù): 2/35頁
文件大?。?/td> 609K
代理商: MC33389CDW
MC33389
MOTOROLA
2
MC33389
MAXIMUM RATINGS
NOTE 1: Pulses 1, 2, 3a, 3b according to ISO7637.
NOTE 2: Refer to thermal management in device description section.
NOTE 3: pins 6,7,8,9,20,21,22,23 of SO28WB package
Description
Symbol
Min
Typ
Max
Unit
Test Conditions
DC Voltage at Pin V
bat
V
bat
-0.3
27
V
Transient Voltage at Pin V
bat
40
V
t<500ms (Load Dump)
DC Voltage at Pins CANH CANL
-20
27
V
Transient Voltage at Pins
CANH CANL
-40
40
V
0<V2<5.5, V
bat
>0,
t<500ms
Coupled Transient Voltage at Pins
CANH CANL
-100
100
V
With 100
Termination
Resistors. Coupled
Through 1nF (note1)
DC Voltage at Pins V1 V2
-0.3
6
V
DC Current at output pins: RX,
MISO, RSTB, INTB
-20
20
mA
DC Voltage at input pins TX, MOSI,
SCLK, CSB, RSTB
-0.3
6
V
DC Voltage at Pins L0, L1, L2
-0.3
40
V
0<V
bat
<40V
Current at Pins L0, L1, L2
-15
mA
Transient Current at Pin V3
-30
20
mA
DC Voltage at Pins RTH, RTL
-0.3
40
V
ESD Voltage on any Pin
(HBM 100pF, 1.5K)
-2
2
kV
ESD Voltage on
L0, L1, L2, CANH, CANL, V
bat
-2
2
kV
ESD Voltage on any Pin
(MM 200pF, 0
).
-150
150
V
Junction Temperature
T
j
-40
150
°C
Junction Temperature
T
jt
-40
160
°C
Storage Temperature
T
s
-65
150
°C
RTH, RTL Termination Resistance
500
16k
Junction to Heatsink Thermal
Resistance for HSOP20
3.1
K/W
33% Power on V1, 66% on
V2 (Including CAN), Note 2
Junction to Pin Thermal
Resistance for SO28WB
17
K/W
Note 2, Note 3
F
Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com
n
.
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