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參數(shù)資料
| 型號(hào)： | MC33880 |
| 廠商： | 飛思卡爾半導(dǎo)體(中國(guó))有限公司 |
| 英文描述： | Configurable Octal Serial Switch with Serial Peripheral Interface I/O(可配置的8串行開(kāi)關(guān),帶串行外圍I/O口(SPI)) |
| 中文描述： | 配置八路系列開(kāi)關(guān)串行外設(shè)接口輸入/輸出（可配置的8串行開(kāi)關(guān)，帶串行外圍的I / O口（SPI）的） |
| 文件頁(yè)數(shù)： | 7/24頁(yè) |
| 文件大?。?/td> | 741K |
| 代理商： | MC33880 |
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MOTOROLA ANALOG INTEGRATED CIRCUIT DEVICE DATA
33880
7
MAXIMUM RATINGS
All voltages are with respect to ground unless otherwise noted.
Rating
Symbol
Value
Unit
V
DD
Supply Voltage (Note 1)
V
DD
-0.3 to 7.0
V
DC
CS
, DI, DO, SCLK, IN5, IN6, and EN (Note 1)
–
-0.3 to 7.0
V
DC
V
PWR
Supply Voltage (Note 1)
V
PWR
-16 to 50
V
DC
Drain 1–8 (Note 2)
5.0 mA
≤
I
OUT
≤
0.3 A
–
-18 to 40
V
DC
Source 1–8 (Note 3)
5.0 mA
≤
I
OUT
≤
0.3 A
–
-28 to 40
V
DC
Output Voltage Clamp Low-Side Drive (Note 4)
V
OC
40 to 55
V
DC
Output Voltage Clamp High-Side Drive (Note 4)
V
OC
-15 to -25
V
DC
Output Clamp Energy (Note 5)
E
CLAMP
50
mJ
ESD Voltage
Human Body Model (Note 6)
Machine Model (Note 7)
V
ESD1
V
ESD2
±2000
±200
V
Storage Temperature
T
STG
-55 to 150
°
C
Operating Case Temperature
T
C
-40 to 125
°
C
Operating Junction Temperature
T
J
-40 to 150
°
C
Maximum Junction Temperature
–
-40 to 150
°
C
Power Dissipation (T
A
= 25
°
C) (Note 8)
28 SOIC, Case 751F-05
32 SOIC, Case 1324-02
P
D
1.3
1.7
W
Thermal Resistance, Junction-to-Ambient, 28 SOIC, Case 751F-05
R
θ
JA
94
°
C/W
Thermal Resistance, Junction-to-Ambient, 32 SOIC, Case 1324-02
Thermal Resistance, Junction-to-Thermal Ground Leads, 32 SOIC, Case 1324-02
R
θ
JA
R
θ
JL
70
18
°
C/W
Notes
1.
2.
3.
4.
5.
6.
7.
8.
Exceeding these limits may cause malfunction or permanent damage to the device.
Configured as low-side driver with 300 mA load as current limit.
Configured as high-side driver with 300 mA load as current limit.
With outputs OFF and 10 mA of test current for low-side driver, 30 mA test current for high-side driver.
Maximum output clamp energy capability at 150
°
C junction temperature using single non-repetitive pulse method.
ESD1 testing is performed in accordance with the Human Body Model (C
ZAP
= 100 pF, R
ZAP
= 1500
).
ESD2 testing is performed in accordance with the Machine Model (C
ZAP
= 200 pF, R
ZAP
= 0
).
Maximum power dissipation with no heatsink used.
F
Freescale Semiconductor, Inc.
Go to: www.freescale.com
n
.
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