參數(shù)資料
型號(hào): MC34923
廠商: 飛思卡爾半導(dǎo)體(中國)有限公司
英文描述: Full-Bridge PWM Motor Driver(全橋PWM電機(jī)驅(qū)動(dòng)器)
中文描述: 全橋PWM電動(dòng)機(jī)驅(qū)動(dòng)器(全橋脈寬調(diào)制電機(jī)驅(qū)動(dòng)器)
文件頁數(shù): 13/16頁
文件大?。?/td> 508K
代理商: MC34923
MOTOROLA ANALOG INTEGRATED CIRCUIT DEVICE DATA
34923
13
APPLICATIONS
Current Sensing
To minimize inaccuracies in sensing the I
TRIP
current level,
which may be caused by ground trace IR drops, the sense
resistor should have an independent ground return to the
ground pin of the device. For low-value sense resistors, the IR
drops in the PCB sense resistor’s traces can be significant and
should be taken into account. The use of sockets should be
avoided because they can introduce variation in R
S
owing to
their contact resistance.
The maximum value of R
S
is given as R
S
0.5/I
TRIP
.
Braking
The braking function is implemented by driving the device in
slow-decay mode via serial port bit D13, enabling synchronous
rectification via bit D12, and chopping with the combination of
D14 and the PWM/ENABLE input pin. Because it is possible to
drive current in either direction through the drivers, this
configuration effectively shorts out the motor-generated back
EMF (BEMF) as long as the PWM/ENABLE chop mode is
asserted. It is important to note that the internal PWM current-
control circuit will not limit the current when braking, because
the current does not flow through the sense resistor. The
maximum brake current can be approximated by V
BEMF
/R
L
.
Care should be taken to ensure that the maximum ratings of the
device are not exceeded in worst-case braking situations of
high-speed and high-inertial loads.
Thermal Protection
Circuitry turns off all drivers when the junction temperature
reaches 165°C typically. It is intended only to protect the device
from failures owing to excessive junction temperatures and
should not imply that output short circuits are permitted.
Thermal shutdown has a hysteresis of approximately 15°C.
Layout
The printed wiring board should use a heavy ground plane.
For optimum electrical and thermal performance (see following
Note), the driver should be soldered directly onto the board. The
ground side of R
S
should have an individual path to the ground
pins of the device. This path should be as short as is possible
physically and should not have any other components
connected to it. It is recommended that a 0.1
μ
F capacitor be
placed between SENSE and ground as close to the device as
possible; the load supply pin, V
BB
, should be decoupled with an
electrolytic capacitor (>47
μ
F is recommended) placed as close
to the device as is possible.
Note
The thermal resistance and absolute maximum
allowable package power dissipation specified in the
MAXIMUM RATINGS
table, page 4, is measured on typical
two-sided PCB with minimal copper ground area. For the
34923, R
θ
JA
can be reduced to 56°C/W with 3.57-in
2
copper
ground area, as shown in
Figure 3
.
Figure 3. Package Dissipation Temperature Derating
A
TEMPERATURE (°C)
50
100
150
125
5
4
3
2
1
0
75
25
R
θ
JA
= 56°C/W
F
Freescale Semiconductor, Inc.
Go to: www.freescale.com
n
.
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