參數(shù)資料
型號(hào)： MC56F8155VFGE
廠商： FREESCALE SEMICONDUCTOR INC
元件分類： 數(shù)字信號(hào)處理
英文描述： 4-BIT, 120 MHz, OTHER DSP, PQFP128
封裝： ROHS COMPLIANT, PLASTIC, LQFP-128
文件頁數(shù)： 39/172頁
文件大?。?/td> 844K
代理商： MC56F8155VFGE
General Characteristics
56F8355 Technical Data, Rev. 17
Freescale Semiconductor
133
Preliminary
1. Theta-JA determined on 2s2p test boards is frequently lower than would be observed in an application. Determined on 2s2p ther-
mal test board.
2. Junction to ambient thermal resistance, Theta-JA (RθJA) was simulated to be equivalent to the JEDEC specification JESD51-2
in a horizontal configuration in natural convection. Theta-JA was also simulated on a thermal test board with two internal planes
(2s2p where “s” is the number of signal layers and “p” is the number of planes) per JESD51-6 and JESD51-7. The correct name
for Theta-JA for forced convection or with the non-single layer boards is Theta-JMA.
3. Junction to case thermal resistance, Theta-JC (RθJC ), was simulated to be equivalent to the measured values using the cold
plate technique with the cold plate temperature used as the "case" temperature. The basic cold plate measurement technique is
described by MIL-STD 883D, Method 1012.1. This is the correct thermal metric to use to calculate thermal performance when
the package is being used with a heat sink.
4. Thermal Characterization Parameter, Psi-JT (
ΨJT ), is the "resistance" from junction to reference point thermocouple on top cen-
ter of case as defined in JESD51-2.
ΨJT is a useful value to use to estimate junction temperature in steady state customer envi-
ronments.
5. Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board) temperature,
ambient temperature, air flow, power dissipation of other components on the board, and board thermal resistance.
6. See Part 12.1 for more details on thermal design considerations.
7. TJ = Junction temperature
Table 10-2 56F8355/56F8155 ElectroStatic Discharge (ESD) Protection
Characteristic
Min
Typ
Max
Unit
ESD for Human Body Model (HBM)
2000
—
V
ESD for Machine Model (MM)
200
—
V
ESD for Charge Device Model (CDM)
500
—
V
Table 10-3 Thermal Characteristics6
Characteristic
Comments
Symbol
Value
Unit
Notes
128-pin LQFP
Junction to ambient
Natural convection
RθJA
50.8
°C/W
2
Junction to ambient (@1m/sec)
RθJMA
46.5
°C/W
2
Junction to ambient
Natural convection
Four layer board (2s2p)
RθJMA
(2s2p)
43.9
°C/W
1,2
Junction to ambient (@1m/sec)
Four layer board (2s2p)
RθJMA
41.7
°C/W
1,2
Junction to case
RθJC
13.9
°C/W
3
Junction to center of case
ΨJT
1.2
°C/W
4, 5
I/O pin power dissipation
P I/O
User-determined
W
Power dissipation
P D
P D = (IDD x VDD + P I/O)W
Maximum allowed PD
PDMAX
(TJ - TA) / R
θJA7
W
相關(guān)PDF資料
PDF描述
MC56F8355VFGE 4-BIT, 120 MHz, OTHER DSP, PQFP128
MC56F8355MFGE 4-BIT, 120 MHz, OTHER DSP, PQFP128
MC56F8157VPY 16-BIT, 120 MHz, OTHER DSP, PQFP160
MC56F8157VPYE 16-BIT, 120 MHz, OTHER DSP, PQFP160
MC56F8357VPY60 16-BIT, 120 MHz, OTHER DSP, PQFP160
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MC56F8156 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:16-bit Digital Signal Controllers
MC56F8156VFV 制造商:Rochester Electronics LLC 功能描述:- Bulk 制造商:Freescale Semiconductor 功能描述:
MC56F8156VFVE 功能描述:數(shù)字信號(hào)處理器和控制器 - DSP, DSC 16 BIT HYBRID CONTROLLER RoHS:否 制造商:Microchip Technology 核心:dsPIC 數(shù)據(jù)總線寬度:16 bit 程序存儲(chǔ)器大小:16 KB 數(shù)據(jù) RAM 大小:2 KB 最大時(shí)鐘頻率:40 MHz 可編程輸入/輸出端數(shù)量:35 定時(shí)器數(shù)量:3 設(shè)備每秒兆指令數(shù):50 MIPs 工作電源電壓:3.3 V 最大工作溫度:+ 85 C 封裝 / 箱體:TQFP-44 安裝風(fēng)格:SMD/SMT
MC56F8157 制造商:未知廠家 制造商全稱:未知廠家 功能描述:16-BIT HYBRID CONTROLLERS
MC56F8157VPY 制造商:Rochester Electronics LLC 功能描述:- Bulk
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