參數(shù)資料
型號： MC56F8157VPY
廠商： FREESCALE SEMICONDUCTOR INC
元件分類： 數(shù)字信號處理
英文描述： 16-BIT, 120 MHz, OTHER DSP, PQFP160
封裝： PLASTIC, LQFP-160
文件頁數(shù)： 80/177頁
文件大?。?/td> 4091K
代理商： MC56F8157VPY
56F8357 Technical Data, Rev. 15
170
Freescale Semiconductor
Preliminary
Part 12 Design Considerations
12.1 Thermal Design Considerations
An estimation of the chip junction temperature, TJ, can be obtained from the equation:
TJ = TA + (RθJΑ x PD)
where:
The junction-to-ambient thermal resistance is an industry-standard value that provides a quick and easy
estimation of thermal performance. Unfortunately, there are two values in common usage: the value
determined on a single-layer board and the value obtained on a board with two planes. For packages such
as the PBGA, these values can be different by a factor of two. Which value is closer to the application
depends on the power dissipated by other components on the board. The value obtained on a single-layer
board is appropriate for the tightly packed printed circuit board. The value obtained on the board with the
internal planes is usually appropriate if the board has low-power dissipation and the components are well
separated.
When a heat sink is used, the thermal resistance is expressed as the sum of a junction-to-case thermal
resistance and a case-to-ambient thermal resistance:
RθJΑ = RθJC + RθCΑ
where:
R θJC is device-related and cannot be influenced by the user. The user controls the thermal environment to
change the case-to-ambient thermal resistance, R θCA . For instance, the user can change the size of the heat
sink, the air flow around the device, the interface material, the mounting arrangement on printed circuit
board, or change the thermal dissipation on the printed circuit board surrounding the device.
To determine the junction temperature of the device in the application when heat sinks are not used, the
Thermal Characterization Parameter (
ΨJT) can be used to determine the junction temperature with a
measurement of the temperature at the top center of the package case using the following equation:
TJ = TT + (ΨJT x PD)
where:
TA
= Ambient temperature for the package (oC)
RθJΑ = Junction-to-ambient thermal resistance (oC/W)
PD
= Power dissipation in the package (W)
RθJA = Package junction-to-ambient thermal resistance °C/W
RθJC
= Package junction-to-case thermal resistance °C/W
RθCA = Package case-to-ambient thermal resistance °C/W
TT = Thermocouple temperature on top of package (oC)
ΨJT = Thermal characterization parameter (oC)/W
PD = Power dissipation in package (W)
Because
of
an
order
from
the
United
States
International
Trade
Commission,
BGA-packaged
product
lines
and
part
numbers
indicated
here
currently
are
not
available
from
Freescale
for
import
or
sale
in
the
United
States
prior
to
September
2010:
MC56F8357,
MC56F8157
相關(guān)PDF資料
PDF描述
MC56F8157VPYE 16-BIT, 120 MHz, OTHER DSP, PQFP160
MC56F8357VPY60 16-BIT, 120 MHz, OTHER DSP, PQFP160
MC56F8166VFV 16-BIT, 120 MHz, OTHER DSP, PQFP144
MC56F8366MFVE 16-BIT, 120 MHz, OTHER DSP, PQFP144
MC56F8366VFVE 16-BIT, 120 MHz, OTHER DSP, PQFP144
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MC56F8157VPYE 功能描述:數(shù)字信號處理器和控制器 - DSP, DSC 16 BIT HYBRID CONTROLLER RoHS:否 制造商:Microchip Technology 核心:dsPIC 數(shù)據(jù)總線寬度:16 bit 程序存儲器大小:16 KB 數(shù)據(jù) RAM 大小:2 KB 最大時鐘頻率:40 MHz 可編程輸入/輸出端數(shù)量:35 定時器數(shù)量:3 設(shè)備每秒兆指令數(shù):50 MIPs 工作電源電壓:3.3 V 最大工作溫度:+ 85 C 封裝 / 箱體:TQFP-44 安裝風(fēng)格:SMD/SMT
MC56F8157VVFE 功能描述:IC DGTL SIGNAL CTLR 160-MAPBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - 微控制器， 系列:56F8xxx 標(biāo)準(zhǔn)包裝:1 系列:87C 核心處理器:MCS 51 芯體尺寸:8-位 速度:16MHz 連通性:SIO 外圍設(shè)備:- 輸入/輸出數(shù):32 程序存儲器容量:8KB（8K x 8） 程序存儲器類型:OTP EEPROM 大小:- RAM 容量:256 x 8 電壓 - 電源 (Vcc/Vdd):4 V ~ 6 V 數(shù)據(jù)轉(zhuǎn)換器:- 振蕩器型:外部 工作溫度:0°C ~ 70°C 封裝/外殼:44-DIP 包裝:管件 其它名稱:864285
MC56F8165 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:16-bit Digital Signal Controllers
MC56F8165E 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:16-bit Digital Signal Controllers
MC56F8165VFG 制造商:Rochester Electronics LLC 功能描述:- Bulk
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