參數(shù)資料
型號: MC68HC05C9AMFN
廠商: FREESCALE SEMICONDUCTOR INC
元件分類: 微控制器/微處理器
英文描述: 8-BIT, MROM, 2.1 MHz, MICROCONTROLLER, PQCC44
封裝: PLASTIC, LCC-44
文件頁數(shù): 4/124頁
文件大?。?/td> 774K
代理商: MC68HC05C9AMFN
MC68HC05C9A Advance Information Data Sheet, Rev. 5.1
Freescale Semiconductor
101
Chapter 13
Mechanical Specifications
13.1 Introduction
This section describes the dimensions of the plastic dual in-line package (DIP), plastic shrink dual in-line
package (SDIP), plastic-leaded chip carrier (PLCC), and quad flat pack (QFP) MCU packages.
Package dimensions available at the time of this publication are provided in this section.
To make sure that you have the latest case outline specifications, contact one of the following:
Local Freescale Sales Office
World Wide Web at http://www.freescale.com
Follow World Wide Web on-line instructions to retrieve the current mechanical specifications.
13.2 40-Pin Plastic Dual In-Line (DIP) Package (Case 711-03)
Figure 13-1. 40-Pin Plastic DIP Package (Case 711-03)
120
40
21
B
A
C
SEATING
PLANE
D
F
G
H
K
N
M
J
L
DIM
MIN
MAX
MIN
MAX
INCHES
MILLIMETERS
A
51.69
52.45
2.035
2.065
B
13.72
14.22
0.540
0.560
C
3.94
5.08
0.155
0.200
D
0.36
0.56
0.014
0.022
F
1.02
1.52
0.040
0.060
G
2.54 BSC
0.100 BSC
H
1.65
2.16
0.065
0.085
J
0.20
0.38
0.008
0.015
K
2.92
3.43
0.115
0.135
L
15.24 BSC
0.600 BSC
M
1
°
N
0.51
1.02
0.020
0.040
NOTES:
1. POSITION TOLERANCE OF LEADS (D), SHALL
BEWITHIN 0.25 (0.010) AT MAXIMUM MATERIAL
CONDITIONS, IN RELATION TO SEATING PLANE
AND EACH OTHER.
2. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
3. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
1
°
0
°
0
°
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