參數(shù)資料
型號(hào): MC68HC705SR3CFB
廠商: MOTOROLA INC
元件分類: 微控制器/微處理器
英文描述: 8-BIT, OTPROM, 2 MHz, MICROCONTROLLER, PQFP44
封裝: QFP-44
文件頁(yè)數(shù): 83/96頁(yè)
文件大?。?/td> 612K
代理商: MC68HC705SR3CFB
MOTOROLA
12-2
MC68HC05SR3
MECHANICAL SPECIFICATIONS
12
12.1
40-Pin DIP Package (Case 711-03)
12.2
42-Pin SDIP Package (Case 858-01)
Figure 12-1 40-pin DIP Package
Figure 12-2 42-pin SDIP Package
MIN
MAX
MILLIMETERS
INCHES
DIM
A
B
C
D
F
G
H
J
K
L
M
N
51.69
13.72
3.94
0.36
1.02
1.65
0.20
2.92
0.51
52.45
14.22
5.08
0.56
1.52
2.16
0.38
3.43
15°
1.02
2.035
0.540
0.155
0.014
0.040
0.065
0.008
0.115
0.020
2.065
0.560
0.200
0.022
0.060
0.085
0.015
0.135
15°
0.040
2.54 BSC
15.24 BSC
0.100 BSC
0.600 BSC
NOTES:
1. POSITIONAL TOLERANCE OF LEADS (D), SHALL
BE WITHIN 0.25 mm (0.010) AT MAXIMUM
MATERIAL CONDITION, IN RELATION TO SEATING
PLANE AND EACH OTHER.
2. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
3. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
120
40
21
B
A
C
N
K
SEATING
PLANE
M
J
L
HG
F
D
1.435
0.540
0.155
0.014
0.032
0.008
0.115
0.020
1.465
0.560
0.200
0.022
0.046
0.015
0.135
15°
0.040
37.21
14.22
5.08
0.56
1.17
0.38
3.43
15°
1.02
36.45
13.72
3.94
0.36
0.81
0.20
2.92
0.51
-B-
-A-
C
D 42 PL
F
K
G
N
J 42 PL
M
MIN
MAX
INCHES
MILLIMETERS
DIM
A
B
C
D
F
G
H
J
K
L
M
N
H
L
1.778 BSC
0.070 BSC
7.62 BSC
0.300 BSC
15.24 BSC
0.600 BSC
0.25 (0.010)
T A
M
S
0.25 (0.010)
T B
M
S
NOTES:
1. DIMENSIONS AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSIONS A AND B DO NOT INCLUDE MOLD
FLASH. MAXIMUM MOLD FLASH 0.25 (0.010).
121
42
22
SEATING
PLANE
-T-
TPG
82
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