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  • 參數(shù)資料
    型號(hào): MC74HCT32AD
    廠商: MOTOROLA INC
    元件分類: 通用總線功能
    英文描述: Octal 2-Input OR Gate with LSTTL Compatible Inputs
    中文描述: HCT SERIES, QUAD 2-INPUT OR GATE, PDSO14
    封裝: PLASTIC, SOIC-14
    文件頁數(shù): 4/5頁
    文件大小: 175K
    代理商: MC74HCT32AD
    MC54/74HCT32A
    MOTOROLA
    High–Speed CMOS Logic Data
    DL129 — Rev 6
    4
    OUTLINE DIMENSIONS
    J SUFFIX
    CERAMIC DIP PACKAGE
    CASE 632–08
    ISSUE Y
    MIN
    0.750
    0.245
    0.155
    0.015
    0.055
    0.100 BSC
    MIN
    19.05
    6.23
    3.94
    0.39
    1.40
    2.54 BSC
    MAX
    0.785
    0.280
    0.200
    0.020
    0.065
    MAX
    19.94
    7.11
    5.08
    0.50
    1.65
    INCHES
    MILLIMETERS
    DIM
    A
    B
    C
    D
    F
    G
    J
    K
    L
    M
    N
    0.015
    0.170
    15
    °
    0.040
    0.008
    0.125
    0.300 BSC
    0
    °
    0.020
    0.38
    4.31
    15
    °
    1.01
    0.21
    3.18
    7.62 BSC
    0
    °
    0.51
    NOTES:
    1. DIMENSIONING AND TOLERANCING PER ANSI
    Y14.5M, 1982.
    2. CONTROLLING DIMENSION: INCH.
    3. DIMENSION L TO CENTER OF LEAD WHEN
    FORMED PARALLEL.
    4. DIMESNION F MAY NARROW TO 0.76 (0.030)
    WHERE THE LEAD ENTERS THE CERAMIC
    BODY.
    14
    8
    1
    7
    -A-
    -B-
    -T-
    SEATING
    PLANE
    F
    G
    N
    K
    C
    L
    M
    0.25 (0.010)
    T
    A
    M
    S
    0.25 (0.010)
    T
    B
    M
    S
    J
    14 PL
    D
    14 PL
    N SUFFIX
    PLASTIC DIP PACKAGE
    CASE 646–06
    ISSUE L
    NOTES:
    1. LEADS WITHIN 0.13 (0.005) RADIUS OF TRUE
    POSITION AT SEATING PLANE AT MAXIMUM
    MATERIAL CONDITION.
    2. DIMENSION L TO CENTER OF LEADS WHEN
    FORMED PARALLEL.
    3. DIMENSION B DOES NOT INCLUDE MOLD
    FLASH.
    4. ROUNDED CORNERS OPTIONAL.
    1
    7
    14
    8
    B
    A
    F
    H
    G
    D
    K
    C
    N
    L
    J
    M
    SEATING
    PLANE
    DIM
    A
    B
    C
    D
    F
    G
    H
    J
    K
    L
    M
    N
    MIN
    0.715
    0.240
    0.145
    0.015
    0.040
    0.100 BSC
    0.052
    0.008
    0.115
    0.300 BSC
    0
    0.015
    MAX
    0.770
    0.260
    0.185
    0.021
    0.070
    MIN
    18.16
    6.10
    3.69
    0.38
    1.02
    MAX
    19.56
    6.60
    4.69
    0.53
    1.78
    MILLIMETERS
    INCHES
    2.54 BSC
    1.32
    0.20
    2.92
    7.62 BSC
    0
    0.39
    0.095
    0.015
    0.135
    2.41
    0.38
    3.43
    10
    10
    1.01
    0.039
    D SUFFIX
    PLASTIC SOIC PACKAGE
    CASE 751A–03
    ISSUE F
    MIN
    8.55
    3.80
    1.35
    0.35
    0.40
    1.27 BSC
    MIN
    0.337
    0.150
    0.054
    0.014
    0.016
    0.050 BSC
    MAX
    8.75
    4.00
    1.75
    0.49
    1.25
    MAX
    0.344
    0.157
    0.068
    0.019
    0.049
    MILLIMETERS
    INCHES
    DIM
    A
    B
    C
    D
    F
    G
    J
    K
    M
    P
    R
    0.19
    0.10
    0
    °
    5.80
    0.25
    0.25
    0.25
    7
    °
    6.20
    0.50
    0.008
    0.004
    0
    °
    0.228
    0.010
    0.009
    0.009
    7
    °
    0.244
    0.019
    NOTES:
    1. DIMENSIONING AND TOLERANCING PER ANSI
    Y14.5M, 1982.
    2. CONTROLLING DIMENSION: MILLIMETER.
    3. DIMENSIONS A AND B DO NOT INCLUDE
    MOLD PROTRUSION.
    4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
    PER SIDE.
    5. DIMENSION D DOES NOT INCLUDE DAMBAR
    PROTRUSION. ALLOWABLE DAMBAR
    PROTRUSION SHALL BE 0.127 (0.005) TOTAL
    IN EXCESS OF THE D DIMENSION AT
    MAXIMUM MATERIAL CONDITION.
    –A–
    –B–
    P
    7 PL
    G
    C
    K
    SEATING
    PLANE
    D
    14 PL
    M
    J
    R
    X 45
    °
    1
    7
    8
    14
    0.25 (0.010)
    T
    B
    A
    M
    S
    S
    B
    0.25 (0.010)
    M
    M
    F
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