參數(shù)資料
型號(hào)： MC74LCX2952SD
廠商： ON SEMICONDUCTOR
元件分類： 總線收發(fā)器
英文描述： LVC/LCX/Z SERIES, 8-BIT REGISTERED TRANSCEIVER, TRUE OUTPUT, PDSO24
封裝： PLASTIC, SSOP-24
文件頁(yè)數(shù)： 28/43頁(yè)
文件大小： 383K
代理商： MC74LCX2952SD
Reliability Information
MOTOROLA
LCX DATA
BR1339 — REV 3
244
stress–related problems could also occur like fractured
wirebonds, passivation cracks, smeared metal on die, etc.
The conditions typically used are 245
°C for IR reflow and
260
°C for solder immersion. For small pitch packages, a
260
°C oil immersion is substituted for the 260°C solder to
avoid solder bridging of the leads.
Physical Dimensions (MIL–STD–883D–2016)
The purpose of this test is to verify the external dimensions
of the device are in accordance with the case outline
specification. This test is typically performed per MIL–STD–
883D Method 2016.
Solderability (MIL–STD–883D–2003)
The purpose of this test is to determine the solderability of
all terminations which are normally joined by a soldering
operation. This test is typically performed per MIL–STD–
883D Method 2003. The test verifies the ability of these
terminations to be wetted or coated by solder, and to predict
suitable fillet when dip soldered. An accelerated aging test is
included in this method which simulates a minimum of six
months natural aging under a combination of various storage
conditions that have a deleterious effect on the solderability.
Marking Permanency (Motorola Std)
The purpose of this test is to verify the device markings will
not become illegible when subjected to solvents, and the
solvents will not cause any mechanical, electrical, damage or
deterioration, of the materials or finishes. This test is typically
performed per Motorola standard.
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