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參數(shù)資料
| 型號(hào)： | MC74LCX573SD |
| 廠商： | ON SEMICONDUCTOR |
| 元件分類(lèi)： | 通用總線功能 |
| 英文描述： | LOW-VOLTAGE CMOS OCTAL TRANSPARENT LATCH |
| 中文描述： | LVC/LCX/Z SERIES, 8-BIT DRIVER, TRUE OUTPUT, PDSO20 |
| 封裝： | PLASTIC, SSOP-20 |
| 文件頁(yè)數(shù)： | 6/8頁(yè) |
| 文件大小： | 158K |
| 代理商： | MC74LCX573SD |
MC74LCX573
MOTOROLA
LCX DATA
BR1339 — REV 3
6
OUTLINE DIMENSIONS
DW SUFFIX
PLASTIC SOIC PACKAGE
CASE 751D–04
ISSUE E
M SUFFIX
PLASTIC SOIC EIAJ PACKAGE
CASE 967–01
ISSUE O
MIN
12.65
7.40
2.35
0.35
0.50
1.27 BSC
MIN
0.499
0.292
0.093
0.014
0.020
0.050 BSC
MAX
12.95
7.60
2.65
0.49
0.90
MAX
0.510
0.299
0.104
0.019
0.035
MILLIMETERS
INCHES
DIM
A
B
C
D
F
G
J
K
M
P
R
0.012
0.009
7
°
0.415
0.029
0.010
0.004
0
°
0.395
0.010
0.32
0.25
7
°
10.55
0.75
0.25
0.10
0
°
10.05
0.25
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.150
(0.006) PER SIDE.
5. DIMENSION D DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.13
(0.005) TOTAL IN EXCESS OF D DIMENSION
AT MAXIMUM MATERIAL CONDITION.
–A
–
–B
–
P
10 PL
1
10
11
20
–T
SEATING
PLANE
D
20 PL
K
C
R
X 45
°
M
0.010 (0.25)
B
M
M
0.010 (0.25)
T
A
B
M
S
S
G
18 PL
F
J
DIM
A
MIN
---
0.05
0.35
0.18
12.35
5.10
MAX
2.05
0.20
0.50
0.27
12.80
5.45
MIN
---
0.002
0.014
0.007
0.486
0.201
0.050 BSC
0.291
0.020
0.043
0
MAX
0.081
0.008
0.020
0.011
0.504
0.215
INCHES
MILLIMETERS
1.27 BSC
7.40
0.50
1.10
0
0.70
---
8.20
0.85
1.50
10
0.323
0.033
0.059
10
0.90
0.81
0.028
---
0.035
0.032
A1
b
c
D
E
e
HE
L
LE
M
Q1
Z
NOTES:
1 DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2 CONTROLLING DIMENSION: MILLIMETER.
3 DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH OR PROTRUSIONS AND ARE MEASURED
AT THE PARTING LINE. MOLD FLASH OR
PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006)
PER SIDE.
4 TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
5 THE LEAD WIDTH DIMENSION (b) DOES NOT
INCLUDE DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)
TOTAL IN EXCESS OF THE LEAD WIDTH
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT. MINIMUM SPACE
BETWEEN PROTRUSIONS AND ADJACENT LEAD
TO BE 0.46 ( 0.018).
Z
D
HE
E
1
20
11
10
b
A1
e
L
LE
Q1
M
VIEW P
DETAIL P
0.13 (0.005)
M
0.10 (0.004)
c
A
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| MC74LCX574DT | 功能描述:觸發(fā)器 2-3.6V CMOS Octal RoHS:否 制造商:Texas Instruments 電路數(shù)量:2 邏輯系列:SN74 邏輯類(lèi)型:D-Type Flip-Flop 極性:Inverting, Non-Inverting 輸入類(lèi)型:CMOS 輸出類(lèi)型: 傳播延遲時(shí)間:4.4 ns 高電平輸出電流:- 16 mA 低電平輸出電流:16 mA 電源電壓-最大:5.5 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:X2SON-8 封裝:Reel |
| MC74LCX574DTG | 功能描述:觸發(fā)器 2-3.6V CMOS Octal D-Type Flow Through RoHS:否 制造商:Texas Instruments 電路數(shù)量:2 邏輯系列:SN74 邏輯類(lèi)型:D-Type Flip-Flop 極性:Inverting, Non-Inverting 輸入類(lèi)型:CMOS 輸出類(lèi)型: 傳播延遲時(shí)間:4.4 ns 高電平輸出電流:- 16 mA 低電平輸出電流:16 mA 電源電壓-最大:5.5 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:X2SON-8 封裝:Reel |
| MC74LCX574DTG | 制造商:ON Semiconductor 功能描述:FLIP-FLOP LOGIC IC |
| MC74LCX574DTR2 | 功能描述:觸發(fā)器 2-3.6V CMOS Octal RoHS:否 制造商:Texas Instruments 電路數(shù)量:2 邏輯系列:SN74 邏輯類(lèi)型:D-Type Flip-Flop 極性:Inverting, Non-Inverting 輸入類(lèi)型:CMOS 輸出類(lèi)型: 傳播延遲時(shí)間:4.4 ns 高電平輸出電流:- 16 mA 低電平輸出電流:16 mA 電源電壓-最大:5.5 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:X2SON-8 封裝:Reel |
| MC74LCX574DTR2G | 功能描述:觸發(fā)器 2-3.6V CMOS Octal D-Type Flow Through RoHS:否 制造商:Texas Instruments 電路數(shù)量:2 邏輯系列:SN74 邏輯類(lèi)型:D-Type Flip-Flop 極性:Inverting, Non-Inverting 輸入類(lèi)型:CMOS 輸出類(lèi)型: 傳播延遲時(shí)間:4.4 ns 高電平輸出電流:- 16 mA 低電平輸出電流:16 mA 電源電壓-最大:5.5 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:X2SON-8 封裝:Reel |
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