MCF5208 ColdFire Microprocessor Data Sheet, Rev. 3 Fr" />
參數(shù)資料
型號： MCF5207CVM166
廠商： Freescale Semiconductor
文件頁數(shù)： 11/46頁
文件大小： 0K
描述： IC MCU 32BIT RISC 144-MAPBGA
標(biāo)準(zhǔn)包裝： 160
系列： MCF520x
核心處理器： Coldfire V2
芯體尺寸： 32-位
速度： 166.67MHz
連通性： EBI/EMI，I²C，SPI，UART/USART
外圍設(shè)備： DMA，WDT
輸入/輸出數(shù)： 30
程序存儲器類型： ROMless
RAM 容量： 16K x 8
電壓 - 電源 (Vcc/Vdd)： 1.4 V ~ 3.6 V
振蕩器型： 外部
工作溫度： -40°C ~ 85°C
封裝/外殼： 144-LBGA
包裝： 托盤
Electrical Characteristics
MCF5208 ColdFire Microprocessor Data Sheet, Rev. 3
Freescale Semiconductor
19
The average chip-junction temperature (TJ) in °C can be obtained from:
Eqn. 1
Where:
TA
= Ambient Temperature,
°C
QJMA
= Package Thermal Resistance, Junction-to-Ambient, ×C/W
PD
=PINT + PI/O
PINT
=IDD × IVDD, Watts - Chip Internal Power
PI/O
= Power Dissipation on Input and Output Pins — User Determined
For most applications PI/O < PINT and can be ignored. An approximate relationship between PD and TJ (if
PI/O is neglected) is:
Eqn. 2
Solving equations 1 and 2 for K gives:
Eqn. 3
where K is a constant pertaining to the particular part. K can be determined from Equation 3 by measuring
PD (at equilibrium) for a known TA. Using this value of K, the values of PD and TJ can be obtained by
solving Equation 1 and Equation 2 iteratively for any value of TA.
5.3
ESD Protection
3 Thermal resistance between the die and the printed circuit board in conformance with JEDEC JESD51-8. Board temperature is
measured on the top surface of the board near the package.
4 Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method
1012.1).
5 Thermal characterization parameter indicating the temperature difference between package top and the junction temperature
per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is written in conformance
with Psi-JT.
6 Thermal characterization parameter indicating the temperature difference between package top and the junction temperature
per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is written in conformance
with Psi-JT.
7 Thermal characterization parameter indicating the temperature difference between package top and the junction temperature
per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is written in conformance
with Psi-JT.
Table 6. ESD Protection Characteristics1, 2
NOTES:
1 All ESD testing is in conformity with CDF-AEC-Q100 Stress Test Qualification for
Automotive Grade Integrated Circuits.
Characteristics
Symbol
Value
Unit
ESD Target for Human Body Model
HBM
2000
V
T
J
T
A
P
D
Θ
JMA
×
()
+
=
P
D
K
T
J
273
°C
+
()
---------------------------------
=
KP
D
T
A
273
°C
×
() Q
JMA
P
D
2
×
+
×
=
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MCF5207CVM166 制造商:Freescale Semiconductor 功能描述:IC 32BIT MPU PBGA-144 制造商:Freescale Semiconductor 功能描述:IC, 32BIT MPU, PBGA-144
MCF5207CVM166J 功能描述:32位微控制器 - MCU ColdFire Micro-Proc RoHS:否 制造商:Texas Instruments 核心:C28x 處理器系列:TMS320F28x 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:90 MHz 程序存儲器大小:64 KB 數(shù)據(jù) RAM 大小:26 KB 片上 ADC:Yes 工作電源電壓:2.97 V to 3.63 V 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:LQFP-80 安裝風(fēng)格:SMD/SMT
MCF5208 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:ColdFire㈢ Microprocessor
MCF5208_07 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:Microprocessor Data Sheet
MCF5208CAB166 功能描述:32位微控制器 - MCU MPC5208 MINIME 160 MQFP RoHS:否 制造商:Texas Instruments 核心:C28x 處理器系列:TMS320F28x 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:90 MHz 程序存儲器大小:64 KB 數(shù)據(jù) RAM 大小:26 KB 片上 ADC:Yes 工作電源電壓:2.97 V to 3.63 V 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:LQFP-80 安裝風(fēng)格:SMD/SMT
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