MCF537x ColdFire Microprocessor Data Sheet, Rev. 4 Fr" />
參數(shù)資料
型號(hào)： MCF5373LCVM240
廠商： Freescale Semiconductor
文件頁(yè)數(shù)： 7/46頁(yè)
文件大?。?/td> 0K
描述： IC MCU 32BIT 240MHZ 196-MAPBGA
標(biāo)準(zhǔn)包裝： 126
系列： MCF537x
核心處理器： Coldfire V3
芯體尺寸： 32-位
速度： 240MHz
連通性： EBI/EMI，以太網(wǎng)，I²C，SPI，SSI，UART/USART，USB，USB OTG
外圍設(shè)備： DMA，POR，PWM，WDT
輸入/輸出數(shù)： 62
程序存儲(chǔ)器類(lèi)型： ROMless
RAM 容量： 32K x 8
電壓 - 電源 (Vcc/Vdd)： 1.4 V ~ 3.6 V
振蕩器型： 外部
工作溫度： -40°C ~ 85°C
封裝/外殼： 196-LBGA
包裝： 托盤(pán)
Electrical Characteristics
MCF537x ColdFire Microprocessor Data Sheet, Rev. 4
Freescale Semiconductor
15
5.2
Thermal Characteristics
The average chip-junction temperature (TJ) in °C can be obtained from:
Eqn. 1
Where:
TA
= Ambient Temperature,
°C
QJMA
= Package Thermal Resistance, Junction-to-Ambient,
°C/W
PD
=PINT + PI/O
PINT
=IDD × IVDD, Watts - Chip Internal Power
PI/O
= Power Dissipation on Input and Output Pins — User Determined
For most applications PI/O < PINT and can be ignored. An approximate relationship between PD and TJ (if PI/O is neglected) is:
Eqn. 2
Solving equations 1 and 2 for K gives:
Eqn. 3
where K is a constant pertaining to the particular part. K can be determined from Equation 3 by measuring PD (at equilibrium)
for a known TA. Using this value of K, the values of PD and TJ can be obtained by solving Equation 1 and Equation 2 iteratively
for any value of TA.
Table 5. Thermal Characteristics
Characteristic
Symbol
256MBGA
196MBGA
160QFP
Unit
Junction to ambient, natural convection
Four layer board
(2s2p)
θ
JMA
371,2
1
θ
JMA and Ψjt parameters are simulated in conformance with EIA/JESD Standard 51-2 for natural convection. Freescale
recommends the use of
θ
JmA and power dissipation specifications in the system design to prevent device junction
temperatures from exceeding the rated specification. System designers should be aware that device junction temperatures
can be significantly influenced by board layout and surrounding devices. Conformance to the device junction temperature
specification can be verified by physical measurement in the customer’s system using the
Ψ
jt parameter, the device power
dissipation, and the method described in EIA/JESD Standard 51-2.
2 Per JEDEC JESD51-6 with the board horizontal.
421,2
°C/W
Junction to ambient (@200 ft/min)
Four layer board
(2s2p)
θ
JMA
381,2
°C/W
Junction to board
θ
JB
273
3 Thermal resistance between the die and the printed circuit board in conformance with JEDEC JESD51-8. Board
temperature is measured on the top surface of the board near the package.
403
°C/W
Junction to case
θ
JC
164
4 Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883
Method 1012.1).
394
°C/W
Junction to top of package
Ψ
jt
41,5
5 Thermal characterization parameter indicating the temperature difference between package top and the junction
temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is
written in conformance with Psi-JT.
°C/W
Maximum operating junction temperature
Tj
105
oC
T
J
T
A
P
D
Θ
JMA
×
()
+
=
P
D
K
T
J
273
°C
+
()
---------------------------------
=
KP
D
T
A
273
°C
×
() Q
JMA
P
D
2
×
+
×
=
Because
of
an
order
from
the
United
States
International
Trade
Commission,
BGA-packaged
product
lines
and
part
numbers
indicated
here
currently
are
not
available
from
Freescale
for
import
or
sale
in
the
United
States
prior
to
September
2010:
MCF53721CVM240,
MCF5372LCVM240,
MCF5373LCVM240
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MCF5373LCVM240J 功能描述:32位微控制器 - MCU V3CORE RoHS:否 制造商:Texas Instruments 核心:C28x 處理器系列:TMS320F28x 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:90 MHz 程序存儲(chǔ)器大小:64 KB 數(shù)據(jù) RAM 大小:26 KB 片上 ADC:Yes 工作電源電壓:2.97 V to 3.63 V 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:LQFP-80 安裝風(fēng)格:SMD/SMT
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